Invention Grant
- Patent Title: High-lead count implant device and method of making the same
- Patent Title (中): 高引线数量的植入装置及其制造方法
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Application No.: US13830272Application Date: 2013-03-14
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Publication No.: US09144490B2Publication Date: 2015-09-29
- Inventor: Yu-Chong Tai , Han-Chieh Chang
- Applicant: California Institute of Technology
- Applicant Address: US CA Pasadena
- Assignee: CALIFORNIA INSTITUTE OF TECHNOLOGY
- Current Assignee: CALIFORNIA INSTITUTE OF TECHNOLOGY
- Current Assignee Address: US CA Pasadena
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01B13/00
- IPC: H01B13/00 ; C23F1/00 ; A61F2/14 ; H01L21/48 ; H01L23/498 ; H01M2/02
Abstract:
The invention provides chip packaging and processes for the assembly of retinal prosthesis devices. Advantageously, photo-patternable adhesive or epoxy such as photoresist is used as glue to attach a chip to the targeted thin-film (e.g., parylene) substrate so that the chip is used as an attachment to prevent delamination.
Public/Granted literature
- US20130297019A1 HIGH-LEAD COUNT IMPLANT DEVICE AND METHOD OF MAKING THE SAME Public/Granted day:2013-11-07
Information query
