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公开(公告)号：US09781842B2
公开(公告)日：2017-10-03
申请号：US14142180
申请日：2013-12-27
Applicant: California Institute of Technology
Inventor： Yu-Chong Tai , Han-Chieh Chang
CPC classification number: H05K3/4038 , A61F9/0017 , H01L23/3135 , H01L2224/73204 , H01L2924/0002 , H05K1/032 , H05K3/0041 , H05K3/281 , H05K3/282 , H05K3/284 , H05K3/285 , H05K3/381 , H05K2201/017 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10075 , H05K2201/10083 , H05K2201/10287 , H05K2201/10356 , H05K2203/0139 , H05K2203/0514 , H05K2203/1316 , H05K2203/1322 , H05K2203/1338 , Y10T29/49165 , H01L2924/00
Abstract: The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation material layer configured to encapsulate the micropackaged device.
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公开(公告)号：US20160105968A1
公开(公告)日：2016-04-14
申请号：US14974242
申请日：2015-12-18
Applicant: California Institute of Technology
Inventor： Yu-Chong Tai , Han-Chieh Chang
CPC classification number: H05K1/189 , A61N1/0543 , A61N1/36046 , H05K3/064 , H05K2201/0154 , H05K2201/052 , H05K2201/1003 , H05K2201/10151
Abstract: A biocompatible, micro-fabricated ribbon cable is described in which at least one set of conductors diverges laterally into a bypass wing that forms an aperture through the ribbon cable. The bypass wing is folded in a line through the aperture and over a central portion of the ribbon cable, resulting in a ribbon cable with a narrow, stacked region. The narrow region can fit through small incisions in membranes, such as through an incision in a sclera of an eyeball. The ribbon cable can have an integrally-formed electrode array for attaching to a retina of an eyeball and other electronics for sending signals to the electrode array.
Abstract translation: 描述了一种生物兼容的微型制造的带状电缆，其中至少一组导体横向分开成通过带状电缆形成孔的旁路翼。 旁路翼片通过孔口并且在带状电缆的中心部分上折叠成一条线，导致带状电缆具有窄的堆叠区域。 狭窄的区域可以穿过膜中的小切口，例如通过眼球巩膜中的切口。 带状电缆可以具有整体形成的电极阵列，用于附接到眼球的视网膜和用于向电极阵列发送信号的其他电子装置。
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公开(公告)号：US20130297019A1
公开(公告)日：2013-11-07
申请号：US13830272
申请日：2013-03-14
Applicant: California Institute of Technology
Inventor： Yu-Chong Tai , Han-Chieh Chang
IPC: A61F2/14
CPC classification number: A61N1/0546 , H01L21/4846 , H01L23/4985 , H01L23/49894 , H01L2924/0002 , H01M2/026 , H01L2924/00
Abstract: The invention provides chip packaging and processes for the assembly of retinal prosthesis devices. Advantageously, photo-patternable adhesive or epoxy such as photoresist is used as glue to attach a chip to the targeted thin-film (e.g., parylene) substrate so that the chip is used as an attachment to prevent delamination.
Abstract translation: 本发明提供了用于组装视网膜假体装置的芯片封装和工艺。 有利地，光可图案化粘合剂或环氧树脂如光致抗蚀剂用作胶粘剂以将芯片附着到目标薄膜（例如聚对二甲苯）基材上，使得芯片用作附着物以防止分层。
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公开(公告)号：US09980388B2
公开(公告)日：2018-05-22
申请号：US14974242
申请日：2015-12-18
Applicant: California Institute of Technology
Inventor： Yu-Chong Tai , Han-Chieh Chang
CPC classification number: H05K1/189 , A61N1/0543 , A61N1/36046 , H05K3/064 , H05K2201/0154 , H05K2201/052 , H05K2201/1003 , H05K2201/10151
Abstract: A biocompatible, micro-fabricated ribbon cable is described in which at least one set of conductors diverges laterally into a bypass wing that forms an aperture through the ribbon cable. The bypass wing is folded in a line through the aperture and over a central portion of the ribbon cable, resulting in a ribbon cable with a narrow, stacked region. The narrow region can fit through small incisions in membranes, such as through an incision in a sclera of an eyeball. The ribbon cable can have an integrally-formed electrode array for attaching to a retina of an eyeball and other electronics for sending signals to the electrode array.
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公开(公告)号：US09144490B2
公开(公告)日：2015-09-29
申请号：US13830272
申请日：2013-03-14
Applicant: California Institute of Technology
Inventor： Yu-Chong Tai , Han-Chieh Chang
CPC classification number: A61N1/0546 , H01L21/4846 , H01L23/4985 , H01L23/49894 , H01L2924/0002 , H01M2/026 , H01L2924/00
Abstract: The invention provides chip packaging and processes for the assembly of retinal prosthesis devices. Advantageously, photo-patternable adhesive or epoxy such as photoresist is used as glue to attach a chip to the targeted thin-film (e.g., parylene) substrate so that the chip is used as an attachment to prevent delamination.
Abstract translation: 本发明提供了用于组装视网膜假体装置的芯片封装和工艺。 有利地，光可图案化粘合剂或环氧树脂如光致抗蚀剂用作胶粘剂以将芯片附着到目标薄膜（例如聚对二甲苯）基材上，使得芯片用作附着物以防止分层。
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Patent Agency Ranking
公开(公告)号：US20180366394A1
公开(公告)日：2018-12-20
申请号：US16008532
申请日：2018-06-14
Applicant: California Institute of Technology
Inventor： Yu-Chong Tai , Han-Chieh Chang
IPC: H01L23/498 , H01L21/02 , H01L21/48 , H01L23/055 , A61N1/05 , H01L23/10 , H01M2/02 , A61N5/06 , A61N1/36
Abstract: The invention provides chip packaging and processes for the assembly of retinal prosthesis devices. Advantageously, photo-patternable adhesive or epoxy such as photoresist is used as glue to attach a chip to the targeted thin-film (e.g., parylene) substrate so that the chip is used as an attachment to prevent delamination.
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公开(公告)号：US09773715B2
公开(公告)日：2017-09-26
申请号：US14981432
申请日：2015-12-28
Applicant: California Institute of Technology
Inventor： Yu-Chong Tai , Han-Chieh Chang
IPC: H01L23/31 , A61B50/30 , B81C1/00 , A61N1/375 , A61F2/14 , A61N1/36 , H01L21/56 , H01L23/00 , A61N1/372
CPC classification number: H01L23/3135 , A61B50/30 , A61F2/14 , A61N1/36046 , A61N1/37211 , A61N1/3758 , B81C1/00 , H01L21/56 , H01L23/564 , H01L2924/0002 , H01L2924/00
Abstract: The present invention provides a micropackaged device comprising: a substrate for securing a device with a corrosion barrier affixed to the substrate, wherein the corrosion barrier comprises a first thin-film layer, a metal film coating the thin-film layer and a second thin-film layer to provide a sandwich layer; and optionally at least one feedthrough disposed in the substrate to permit at least one input and or at least one output line into the micropackaged device, wherein the micropackaged device is encapsulated by the corrosion barrier. Methods of producing the micropackaged device are also disclosed.
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公开(公告)号：US20160105973A1
公开(公告)日：2016-04-14
申请号：US14974404
申请日：2015-12-18
Applicant: California Institute of Technology
Inventor： Yu-Chong Tai , Han-Chieh Chang , Xiaoxiao Zhang
CPC classification number: H05K3/242 , A61N1/0543 , C23C14/14 , C23C14/24 , C25D1/04 , H05K1/189 , H05K3/064 , H05K3/244 , H05K3/28 , H05K3/321 , H05K3/4007 , H05K2203/0191 , H05K2203/0361 , H05K2203/0723 , H05K2203/1338
Abstract: Methods, and devices produced by the methods, for electroplating a multitude of micro-scale electrodes that are electrically isolated from each other on a cable or other device is described. A localized area of connections on another end of the cable is shorted together by depositing a metal sheet or other conductive material over the localized area. The metal sheet is connected to a terminal of a power supply, and the electrode end of the cable is immersed in an electrolyte solution for electrodeposition by electroplating. After the electrodes are electroplated, the metal sheet is removed from the cable in order to re-isolate the electrodes.
Abstract translation: 描述了通过该方法产生的用于电镀多个在电缆或其它设备上彼此电隔离的微尺度电极的方法和装置。 通过在局部区域上沉积金属片或其它导电材料，将电缆的另一端上的局部连接区域短路在一起。 金属片与电源的端子连接，将电缆的电极端浸渍在电解液中，通过电镀电沉积。 在电极电镀之后，将金属片从电缆中取出，以便重新隔离电极。
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公开(公告)号：US10008443B2
公开(公告)日：2018-06-26
申请号：US14838788
申请日：2015-08-28
Applicant: California Institute of Technology
Inventor： Yu-Chong Tai , Han-Chieh Chang
IPC: A61F2/16 , H01B13/00 , H01L23/498 , H01L21/48 , H01L23/055 , H01L21/02 , A61N1/05 , A61N1/36 , A61N5/06 , H01M2/02 , H01L23/10
Abstract: The invention provides chip packaging and processes for the assembly of retinal prosthesis devices. Advantageously, photo-patternable adhesive or epoxy such as photoresist is used as glue to attach a chip to the targeted thin-film (e.g., parylene) substrate so that the chip is used as an attachment to prevent delamination.
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公开(公告)号：US20160133540A1
公开(公告)日：2016-05-12
申请号：US14981432
申请日：2015-12-28
Applicant: California Institute of Technology
Inventor： Yu-Chong Tai , Han-Chieh Chang
CPC classification number: H01L23/3135 , A61B50/30 , A61F2/14 , A61N1/36046 , A61N1/37211 , A61N1/3758 , B81C1/00 , H01L21/56 , H01L23/564 , H01L2924/0002 , H01L2924/00
Abstract: The present invention provides a micropackaged device comprising: a substrate for securing a device with a corrosion barrier affixed to the substrate, wherein the corrosion barrier comprises a first thin-film layer, a metal film coating the thin-film layer and a second thin-film layer to provide a sandwich layer; and optionally at least one feedthrough disposed in the substrate to permit at least one input and or at least one output line into the micropackaged device, wherein the micropackaged device is encapsulated by the corrosion barrier. Methods of producing the micropackaged device are also disclosed.
Abstract translation: 本发明提供了一种微封装装置，其特征在于，包括：基板，用于固定具有固定在所述基板上的防腐蚀屏障的装置，其中，所述腐蚀阻挡层包括第一薄膜层，涂覆所述薄膜层的金属膜和第二薄膜层， 薄膜层提供夹心层; 以及可选地，至少一个馈通设置在所述基板中以允许至少一个输入和/或至少一个输出线进入所述微封装装置，其中所述微封装装置被所述腐蚀屏障包封。 还公开了生产微封装器件的方法。
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