Invention Grant
US09155203B2 Apparatus for manufacturing flexible printed wiring board, apparatus for manufacturing wiring board, and applying device
有权
用于制造柔性印刷线路板的装置，用于制造布线板的装置和施加装置
- Patent Title: Apparatus for manufacturing flexible printed wiring board, apparatus for manufacturing wiring board, and applying device
- Patent Title (中): 用于制造柔性印刷线路板的装置，用于制造布线板的装置和施加装置
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Application No.: US13463580Application Date: 2012-05-03
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Publication No.: US09155203B2Publication Date: 2015-10-06
- Inventor: Akihiko Happoya , Yasuki Torigoshi , Sadahiro Tamai
- Applicant: Akihiko Happoya , Yasuki Torigoshi , Sadahiro Tamai
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Blakely Sokoloff Taylor and Zafman LLP
- Priority: JP2011-218615 20110930
- Main IPC: B05B7/06
- IPC: B05B7/06 ; B05C13/02 ; H01L21/4763 ; H05K3/02 ; H05K3/40 ; H05K1/18 ; H05K3/28
Abstract:
According to one embodiment, an apparatus includes: a device configured to partially provide a second conductor layer on a surface of a first conductor layer; a device configured to partially provide a first insulating layer on the surface of the first conductor layer; a device configured to integrate the first conductor layer, the second conductor layer, the first insulating layer, and a third conductor layer, in a state in which the second conductor layer and the first insulating layer provided on the surface of the first conductor layer are covered with the third conductor layer from a side opposite the first conductor layer; a device configured to form a conductor pattern by partially removing at least one of the first conductor layer and the third conductor layer in a structure obtained by the integrating; and a device configured to cover both sides of the structure.
Public/Granted literature
Information query
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