Invention Grant
- Patent Title: Contact and interconnect metallization for solar cells
- Patent Title (中): 太阳能电池的接触和互连金属化
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Application No.: US13791067Application Date: 2013-03-08
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Publication No.: US09184333B2Publication Date: 2015-11-10
- Inventor: Suketu Arun Parikh , Jen Shu , James M. Gee
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: H01L31/0224
- IPC: H01L31/0224 ; H01L31/18 ; H01L21/67 ; H01L31/0216 ; H01L31/068
Abstract:
A fabrication line includes a texturizing module configured to texture a substrate, an emitter module configured to form an emitter region, a passivation layer module configured to form a passivation layer, a barrier contact module configured to form a barrier contact region, a firing module configured to anneal the barrier contact region, a top metal contact module configured to form a top metal contact region, and a soldering module configured to solder the barrier contact region to the top metal contact region. The modules are integrated by one or more automated substrate handlers into a single fabrication line. A method for fabricating a solar cell includes sequentially, in an automated fabrication line: doping a dopant in a substrate; disposing a passivation layer; disposing and annealing a barrier metal paste to form a barrier contact; and disposing and annealing a metal contact paste to form a top metal contact region.
Public/Granted literature
- US20130288424A1 CONTACT AND INTERCONNECT METALLIZATION FOR SOLAR CELLS Public/Granted day:2013-10-31
Information query
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