Invention Grant
- Patent Title: Damping device for a micromechanical sensor device
- Patent Title (中): 用于微机械传感器装置的阻尼装置
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Application No.: US13757082Application Date: 2013-02-01
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Publication No.: US09222955B2Publication Date: 2015-12-29
- Inventor: Holger Hoefer , Ricardo Ehrenpfordt , Klaus Offterdinger , Christian Solf
- Applicant: Holger Hoefer , Ricardo Ehrenpfordt , Klaus Offterdinger , Christian Solf
- Applicant Address: DE Stuttgart
- Assignee: ROBERT BOSCH GMBH
- Current Assignee: ROBERT BOSCH GMBH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102012201486 20120202
- Main IPC: G01P1/00
- IPC: G01P1/00 ; H05K3/00 ; G01P15/08 ; H05K1/14 ; H05K1/02
Abstract:
A damping device for a micromechanical sensor device, having at least one first intermediate layer having at least two sections, a second section being situated around a first section, a lateral distance being provided between the first and the second section, and an elastic device being provided between the first section and the second section as an integral part of the first intermediate layer.
Public/Granted literature
- US20130199295A1 DAMPING DEVICE FOR A MICROMECHANICAL SENSOR DEVICE Public/Granted day:2013-08-08
Information query
