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公开(公告)号：US20130199295A1
公开(公告)日：2013-08-08
申请号：US13757082
申请日：2013-02-01
Applicant: Holger HOEFER , Ricardo EHRENPFORDT , Klaus OFFTERDINGER , Christian SOLF
Inventor： Holger HOEFER , Ricardo EHRENPFORDT , Klaus OFFTERDINGER , Christian SOLF
CPC classification number: G01P1/003 , G01P15/0802 , G01P2015/0882 , H01L2224/16225 , H01L2924/15311 , H05K1/0271 , H05K1/141 , H05K3/00 , H05K2201/049 , H05K2201/10151 , Y10T29/4913
Abstract: A damping device for a micromechanical sensor device, having at least one first intermediate layer having at least two sections, a second section being situated around a first section, a lateral distance being provided between the first and the second section, and an elastic device being provided between the first section and the second section as an integral part of the first intermediate layer.
Abstract translation: 一种用于微机械传感器装置的阻尼装置，具有至少一个具有至少两个部分的第一中间层，第二部分围绕第一部分设置，横向距离设置在第一和第二部分之间，弹性装置为 设置在第一部分和第二部分之间，作为第一中间层的整体部分。
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公开(公告)号：US20110049505A1
公开(公告)日：2011-03-03
申请号：US12871666
申请日：2010-08-30
Applicant: Johannes Grabowski , Holger Hoefer , Thomas Klaus , Gerald Hopf
Inventor： Johannes Grabowski , Holger Hoefer , Thomas Klaus , Gerald Hopf
CPC classification number: H01L23/645 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/0655 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48465 , H01L2224/48471 , H01L2224/49052 , H01L2224/49175 , H01L2224/4945 , H01L2224/85181 , H01L2224/85186 , H01L2224/85986 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/30105 , H01L2224/78 , H01L2224/05599 , H01L2924/00012 , H01L2924/00
Abstract: A device includes a first semiconductor chip and a second semiconductor chip which are connected to each other in an electrically conductive manner via a bonding wire, the bonding wire having a contact to the first semiconductor chip at a first contact point and having a contact to the second semiconductor chip at a second contact point, and the device including a further bonding wire which has a further first contact point and a further second contact point, a maximum distance between the bonding wire and a direct connecting line between the first and second contact points perpendicular to the connecting line being greater than a further maximum distance between the further bonding wire and a further connecting line between the further first contact point and the further second contact point perpendicular to the further connecting line.
Abstract translation: 一种器件包括通过接合线以导电方式彼此连接的第一半导体芯片和第二半导体芯片，所述接合线在第一接触点处具有与所述第一半导体芯片的接触，并且具有与所述第一接触点的接触 所述第二半导体芯片在第二接触点处，并且所述器件包括另外的接合线，所述另外的接合线具有另外的第一接触点和另外的第二接触点，所述接合线与所述第一和第二接触点之间的直接连接线之间的最大距离 垂直于连接线的另一个连接线大于另外的接合线之间的另一最大距离，以及另外的第一接触点和垂直于另一连接线的另外的第二接触点之间的另一连接线。
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3.发明申请MICROMECHANICAL STRUCTURE HAVING A SUBSTRATE AND A THERMOELEMENT, TEMPERATURE SENSOR AND/OR RADIATION SENSOR, AND METHOD FOR MANUFACTURING A MICROMECHANICAL STRUCTURE 审中-公开具有基板和热敏元件的温度结构，温度传感器和/或辐射传感器以及用于制造微机械结构的方法公开(公告)号：US20090168836A1
公开(公告)日：2009-07-02
申请号：US12097891
申请日：2006-11-24
Applicant: Holger Hoefer , Axel Grosse
Inventor： Holger Hoefer , Axel Grosse
CPC classification number: G01J5/12
Abstract: A micromechanical structure, a temperature and/or radiation sensor, and a method for manufacturing a micromechanical structure are suggested, the micromechanical structure including a substrate and a thermoelement having a reference contact and a measuring contact, the substrate having a main substrate plane), the thermoelement having a first material between the reference contact and the measuring contact and a second material between the measuring contact and a further reference contact, either the first material being situated over the second material or the second material being situated over the first material between the reference contact and the measuring contact in a direction perpendicular to the main substrate plane.
Abstract translation: 提出了一种微机械结构，温度和/或辐射传感器以及微机械结构的制造方法，该微机械结构包括具有基准接触和测量接触的基片和热电偶，该基片具有主基片平面）， 所述热电元件在所述参考接触件和所述测量接触件之间具有第一材料，以及在所述测量接触件和另一参考接触件之间的第二材料，所述第一材料位于所述第二材料上方或所述第二材料位于所述第一材料之间， 参考接触和测量接触在垂直于主基板平面的方向上。
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公开(公告)号：US06974515B2
公开(公告)日：2005-12-13
申请号：US10352709
申请日：2003-01-27
Applicant: Anja Neubert , Holger Hoefer
Inventor： Anja Neubert , Holger Hoefer
IPC: G01L1/22 , B32B9/00 , B32B18/00 , C04B35/00 , C04B35/622 , G01L9/04 , H05K1/03 , H05K3/00 , B32B31/26
CPC classification number: B32B18/00 , B32B2315/02 , C04B2235/9607 , C04B2237/341 , C04B2237/343 , C04B2237/582 , C04B2237/76 , H05K1/0306 , H05K3/0014 , H05K2201/0195 , H05K2201/068 , H05K2201/09018
Abstract: A ceramic substrate having a defined curvature and a method of its manufacture are described. For this purpose at least two ceramic layers having different defined temperature coefficients of expansion are positioned on top of one another and are permanently bonded together. A curved ceramic substrate may be advantageously utilized in micro-hybrid technology, in multilayer ceramic technology, or in hybrid technology, e.g., as a membrane element of a piezoresistive pressure sensor element.
Abstract translation: 描述了具有限定曲率的陶瓷衬底及其制造方法。 为此，具有不同的限定温度膨胀系数的至少两个陶瓷层位于彼此之上并永久地结合在一起。 弯曲的陶瓷衬底可以有利地用于微混合技术，多层陶瓷技术或混合技术中，例如作为压阻式压力传感器元件的膜元件。
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公开(公告)号：US20110203369A1
公开(公告)日：2011-08-25
申请号：US12931011
申请日：2011-01-21
Applicant: Holger Hoefer , Uwe Hansen , Michael Knauss
Inventor： Holger Hoefer , Uwe Hansen , Michael Knauss
IPC: G01D11/24
CPC classification number: G01P1/023 , B81B7/0048 , G01D3/028 , G01D11/245 , G06K19/07747 , H01L2224/48137
Abstract: A sensor system includes a supporting element and a sensor element attached to the supporting element and having a main plane of extension. The supporting element has (i) at least one contact element for electrical contacting of the sensor system and (ii) at least one relief structure for stress decoupling, the at least one relief structure being situated in a plane parallel to the main plane of extension essentially between the at least one contact element and the sensor element.
Abstract translation: 传感器系统包括支撑元件和附接到支撑元件并具有主平面延伸的传感器元件。 所述支撑元件具有（i）至少一个用于所述传感器系统的电接触的接触元件和（ii）用于应力解耦的至少一个浮雕结构，所述至少一个浮雕结构位于平行于所述主延伸平面的平面中 基本上在所述至少一个接触元件和所述传感器元件之间。
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Patent Agency Ranking
公开(公告)号：US09222955B2
公开(公告)日：2015-12-29
申请号：US13757082
申请日：2013-02-01
Applicant: Holger Hoefer , Ricardo Ehrenpfordt , Klaus Offterdinger , Christian Solf
Inventor： Holger Hoefer , Ricardo Ehrenpfordt , Klaus Offterdinger , Christian Solf
CPC classification number: G01P1/003 , G01P15/0802 , G01P2015/0882 , H01L2224/16225 , H01L2924/15311 , H05K1/0271 , H05K1/141 , H05K3/00 , H05K2201/049 , H05K2201/10151 , Y10T29/4913
Abstract: A damping device for a micromechanical sensor device, having at least one first intermediate layer having at least two sections, a second section being situated around a first section, a lateral distance being provided between the first and the second section, and an elastic device being provided between the first section and the second section as an integral part of the first intermediate layer.
Abstract translation: 一种用于微机械传感器装置的阻尼装置，具有至少一个具有至少两个部分的第一中间层，第二部分围绕第一部分设置，横向距离设置在第一和第二部分之间，弹性装置为 设置在第一部分和第二部分之间，作为第一中间层的整体部分。
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公开(公告)号：US20120025863A1
公开(公告)日：2012-02-02
申请号：US13156208
申请日：2011-06-08
Applicant: Eric Ochs , Holger Hoefer , Lutz Rauscher , Eckart Schellkes , Florian Grabmaier
Inventor： Eric Ochs , Holger Hoefer , Lutz Rauscher , Eckart Schellkes , Florian Grabmaier
CPC classification number: H05K1/0268 , H01L23/3121 , H01L23/49805 , H01L24/48 , H01L24/49 , H01L2224/48229 , H01L2224/49 , H01L2924/00014 , H01L2924/01068 , H01L2924/14 , H01L2924/181 , H05K3/3436 , H05K2201/09663 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: An integrated circuit includes an electronic circuit in a housing and a first contacting device for soldering the circuit to a corresponding second contacting device of a circuit board. The first and second contacting devices are each divided into a first section and a second section, the sections of one of the contacting devices being fixedly electrically connected to each other, and the sections of the other contacting device being selectively connectable to a device for resistance determination.
Abstract translation: 集成电路包括壳体中的电子电路和用于将电路焊接到电路板的对应的第二接触装置的第一接触装置。 第一和第二接触装置分别被分成第一部分和第二部分，其中一个接触装置的部分彼此固定地电连接，另一个接触装置的部分可选择性地连接到用于电阻的装置 决心。
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公开(公告)号：US20090174148A1
公开(公告)日：2009-07-09
申请号：US12086893
申请日：2006-11-24
Applicant: Udo Bischof , Holger Hoefer , Volker Schmitz , Axel Grosse , Lutz Mueller , Ralf Hausner
Inventor： Udo Bischof , Holger Hoefer , Volker Schmitz , Axel Grosse , Lutz Mueller , Ralf Hausner
IPC: F16J15/02
CPC classification number: B81C1/00293 , B81C2203/0145
Abstract: An integrated component having a substrate, the substrate having a cavity which surrounds a mechanical structure. The cavity is filled by a fluid of a specific composition under a specific pressure, and the mechanical properties of the mechanical structure are influenced by the fluid.
Abstract translation: 具有基板的集成部件，该基板具有围绕机械结构的空腔。 空腔由特定组成的流体在特定压力下填充，机械结构的机械性能受到流体的影响。
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公开(公告)号：US08671752B2
公开(公告)日：2014-03-18
申请号：US12931011
申请日：2011-01-21
Applicant: Holger Hoefer , Uwe Hansen , Michael Knauss
Inventor： Holger Hoefer , Uwe Hansen , Michael Knauss
CPC classification number: G01P1/023 , B81B7/0048 , G01D3/028 , G01D11/245 , G06K19/07747 , H01L2224/48137
Abstract: A sensor system includes a supporting element and a sensor element attached to the supporting element and having a main plane of extension. The supporting element has (i) at least one contact element for electrical contacting of the sensor system and (ii) at least one relief structure for stress decoupling, the at least one relief structure being situated in a plane parallel to the main plane of extension essentially between the at least one contact element and the sensor element.
Abstract translation: 传感器系统包括支撑元件和附接到支撑元件并具有主平面延伸的传感器元件。 所述支撑元件具有（i）至少一个用于所述传感器系统的电接触的接触元件和（ii）用于应力解耦的至少一个浮雕结构，所述至少一个浮雕结构位于平行于所述主延伸平面的平面中 基本上在所述至少一个接触元件和所述传感器元件之间。
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公开(公告)号：US08304845B2
公开(公告)日：2012-11-06
申请号：US12086893
申请日：2006-11-24
Applicant: Udo Bischof , Holger Hoefer , Volker Schmitz , Axel Grosse , Lutz Mueller , Ralf Hausner
Inventor： Udo Bischof , Holger Hoefer , Volker Schmitz , Axel Grosse , Lutz Mueller , Ralf Hausner
IPC: H01L29/84
CPC classification number: B81C1/00293 , B81C2203/0145
Abstract: An integrated component having a substrate, the substrate having a cavity which surrounds a mechanical structure. The cavity is filled by a fluid of a specific composition under a specific pressure, and the mechanical properties of the mechanical structure are influenced by the fluid.
Abstract translation: 具有基板的集成部件，该基板具有围绕机械结构的空腔。 空腔由特定组成的流体在特定压力下填充，机械结构的机械性能受到流体的影响。
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