A mounting structure between the spectral filter and optical sensor includes one or more beads of epoxy that are bonded to the face of the sensor at locations adjacent and bonded to the edge of the spectral filter around its perimeter. Placement of the epoxy so that it bonds to the edge of the spectral filter improves the robustness of the package to sheer stresses. Placement of the epoxy at the edge, suitably in discrete spot bonds, also avoids putting epoxy in the optical path, contaminating the optically active area or using epoxy to control the gap height. Alignment of the spectral filter in the plane (x,y) may be achieved using fiducial marks on the sensor and filter. Alignment of the spectral filter out of the plane (z) may be achieved using incompressible spacer balls that set the gap height precisely to the diameter of the ball. Alternately, the spectral filter may be placed in direct contact with the optically active area of the sensor.