Invention Grant
- Patent Title: Substrate treating apparatus
- Patent Title (中): 底物处理装置
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Application No.: US13401617Application Date: 2012-02-21
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Publication No.: US09230834B2Publication Date: 2016-01-05
- Inventor: Yoshiteru Fukutomi , Tsuyoshi Mitsuhashi , Hiroyuki Ogura , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
- Applicant: Yoshiteru Fukutomi , Tsuyoshi Mitsuhashi , Hiroyuki Ogura , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
- Applicant Address: JP Kyoto
- Assignee: SCREEN Semiconductor Solutions Co., Ltd.
- Current Assignee: SCREEN Semiconductor Solutions Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2007-172496 20070629
- Main IPC: B05D3/12
- IPC: B05D3/12 ; H01L21/677 ; H01L21/67 ; B05C13/00 ; B05D3/04 ; B05B15/12 ; H01L23/34
Abstract:
A substrate treating method for treating substrates with a substrate treating apparatus having an indexer section, a treating section and an interface section includes performing resist film forming treatment in parallel on a plurality of stories provided in the treating section and performing developing treatment in parallel on a plurality of stories provided in the treating section.
Public/Granted literature
- US20120156380A1 SUBSTRATE TREATING APPARATUS Public/Granted day:2012-06-21
Information query
