Invention Grant
- Patent Title: Ion implantation apparatus and ion implantation method
- Patent Title (中): 离子注入装置和离子注入方法
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Application No.: US14732239Application Date: 2015-06-05
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Publication No.: US09236222B2Publication Date: 2016-01-12
- Inventor: Takanori Yagita , Mitsuaki Kabasawa
- Applicant: Sumitomo Heavy Industries Ion Technology Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Heavy Industries Ion Technology Co., Ltd.
- Current Assignee: Sumitomo Heavy Industries Ion Technology Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JP2014-118901 20140609
- Main IPC: H01J37/317
- IPC: H01J37/317 ; H01J37/147 ; H01J37/10

Abstract:
An ion implantation apparatus includes a beam scanning unit and a beam parallelizing unit arranged downstream thereof. The beam scanning unit has a scan origin in a central part of the scanning unit on a central axis of an incident ion beam. The beam parallelizing unit has a focal point of a parallelizing lens at the scan origin. The ion implantation apparatus is configured such that a focal position of the incident beam into the scanning unit is located upstream of the scan origin along the central axis of the incident beam. The focal position of the incident beam into the scanning unit is adjusted to be at a position upstream of the scan origin along the central axis of the incident beam such that a divergence phenomenon caused by the space charge effect in an exiting ion beam from the parallelizing unit is compensated.
Public/Granted literature
- US20150357160A1 ION IMPLANTATION APPARATUS AND ION IMPLANTATION METHOD Public/Granted day:2015-12-10
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