Invention Grant
- Patent Title: Apparatus and method for treating substrate
- Patent Title (中): 底物处理装置及方法
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Application No.: US13485300Application Date: 2012-05-31
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Publication No.: US09263307B2Publication Date: 2016-02-16
- Inventor: Hyung Joon Kim
- Applicant: Hyung Joon Kim
- Applicant Address: KR Cheonan-si, Chungcheongnam-do
- Assignee: Semes Co., Ltd.
- Current Assignee: Semes Co., Ltd.
- Current Assignee Address: KR Cheonan-si, Chungcheongnam-do
- Agency: Jenkins, Wilson, Taylor & Hunt, P.A.
- Priority: KR10-2011-0052430 20110531; KR10-2011-0082678 20110819
- Main IPC: B25J11/00
- IPC: B25J11/00 ; H01L21/677 ; F27D3/00 ; H01L21/67 ; C23F1/00 ; B05D3/02 ; C23C16/513 ; B05D1/00

Abstract:
Provided are an apparatus and method for treating a substrate, and more particularly, to a substrate treatment apparatus having a cluster structure and a substrate treatment method using the same. The apparatus for treating the substrate includes a load port on which a container for receiving the substrate is placed, a treatment module for treating the substrate, and a transfer module including a robot for transferring the substrate between the container and the treatment module. The treatment module includes a transfer chamber including a robot for transferring the substrate, a load lock chamber disposed between the transfer chamber and the transfer module, a first treatment chamber disposed spaced from the transfer module around the transfer chamber to perform a first treatment process, and a second treatment chamber disposed around the transfer chamber to perform a second treatment process.
Public/Granted literature
- US20120322015A1 APPARATUS AND METHOD FOR TREATING SUBSTRATE Public/Granted day:2012-12-20
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