Invention Grant
- Patent Title: Method for mounting chip on printed circuit board
- Patent Title (中): 将芯片安装在印刷电路板上的方法
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Application No.: US14488814Application Date: 2014-09-17
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Publication No.: US09281339B1Publication Date: 2016-03-08
- Inventor: Chi-Chou Lin , Zheng-Ping He
- Applicant: SunASIC Technologies, Inc.
- Applicant Address: TW New Taipei
- Assignee: Sunasic Technologies, Inc.
- Current Assignee: Sunasic Technologies, Inc.
- Current Assignee Address: TW New Taipei
- Agency: Law Office of Michael Chen
- Agent Che-Yang Chen
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L21/48 ; H01L23/538
Abstract:
A method for mounting a chip on a printed circuit board (PCB) is disclosed. The method includes the steps of: providing a chip having a plurality of bonding pads and a PCB having a recess portion and a plurality of connectors; gluing the recess portion; placing the chip into the recess portion; and forming circuit patterns linking associated bonding pad and connector. A bottom of the recess portion is substantially flat and a shape of the recess portion is similar to that of the chip but large enough so that the chip can be fixed in the recess portion after being glued.
Public/Granted literature
- US20160079289A1 METHOD FOR MOUNTING CHIP ON PRINTED CIRCUIT BOARD Public/Granted day:2016-03-17
Information query
IPC分类:
