Invention Grant
- Patent Title: Semiconductor material doping
- Patent Title (中): 半导体材料掺杂
-
Application No.: US13803753Application Date: 2013-03-14
-
Publication No.: US09287442B2Publication Date: 2016-03-15
- Inventor: Maxim S Shatalov , Remigijus Gaska , Jinwei Yang , Michael Shur , Alexander Dobrinsky
- Applicant: Sensor Electronic Technology, Inc.
- Applicant Address: US SC Columbia
- Assignee: Sensor Electronic Technology, Inc.
- Current Assignee: Sensor Electronic Technology, Inc.
- Current Assignee Address: US SC Columbia
- Agency: LaBatt, LLC
- Main IPC: H01L33/06
- IPC: H01L33/06 ; H01L33/00 ; B82Y10/00 ; B82Y20/00 ; H01L29/20 ; H01L29/201 ; H01L29/15 ; H01L29/205 ; H01L33/32 ; H01L33/04 ; H01S5/20 ; H01S5/32 ; H01S5/343 ; H01S5/34

Abstract:
A solution for designing and/or fabricating a structure including a quantum well and an adjacent barrier is provided. A target band discontinuity between the quantum well and the adjacent barrier is selected to coincide with an activation energy of a dopant for the quantum well and/or barrier. For example, a target valence band discontinuity can be selected such that a dopant energy level of a dopant in the adjacent barrier coincides with a valence energy band edge for the quantum well and/or a ground state energy for free carriers in a valence energy band for the quantum well. Additionally, a target doping level for the quantum well and/or adjacent barrier can be selected to facilitate a real space transfer of holes across the barrier. The quantum well and the adjacent barrier can be formed such that the actual band discontinuity and/or actual doping level(s) correspond to the relevant target(s).
Public/Granted literature
- US20140077154A1 Semiconductor Material Doping Public/Granted day:2014-03-20
Information query
IPC分类: