Invention Grant
- Patent Title: Electrostatic discharge protection structure and fabrication method thereof
- Patent Title (中): 静电放电保护结构及其制造方法
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Application No.: US14130481Application Date: 2013-04-27
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Publication No.: US09343454B2Publication Date: 2016-05-17
- Inventor: Yonghai Hu , Meng Dai , Zhongyu Lin , Guangyang Wang
- Applicant: CSMC Technologies Fab1 Co., Ltd.
- Applicant Address: CN Wuxi, Jiangsu
- Assignee: CSMC TECHNOLOGIES FAB1 CO., LTD.
- Current Assignee: CSMC TECHNOLOGIES FAB1 CO., LTD.
- Current Assignee Address: CN Wuxi, Jiangsu
- Agency: Han IP Corporation
- Priority: CN201210130387 20120428
- International Application: PCT/CN2013/074896 WO 20130427
- International Announcement: WO2013/159746 WO 20131031
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/338 ; H01L27/02 ; H01L29/87 ; H01L21/762 ; H01L21/8232

Abstract:
An electrostatic discharge protection structure includes: substrate of a first type of conductivity, well region of a second type of conductivity, substrate contact region in the substrate and of the first type of conductivity, well contact region in the well region and of the second type of conductivity, substrate counter-doped region between the substrate contact region and the well contact region and of the second type of conductivity, well counter-doped region between the substrate contact region and the well contact region and of the first type of conductivity, communication region at a lateral junction between the substrate and the well region, first isolation region between the substrate counter-doped region and the communication region, second isolation region between the well counter-doped region and the communication region, oxide layer having one end on the first isolation region and another end on the substrate, and field plate structure on the oxide layer.
Public/Granted literature
- US20140138740A1 Electrostatic Discharge Protection Structure And Fabrication Method Thereof Public/Granted day:2014-05-22
Information query
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