A laser ablation system and methods are disclosed for performing material analysis. The laser ablation system includes a sample chamber which holds and encloses a sample material to be ablated; a laser source that produces a laser beam which is directed into the sample chamber to a surface of the sample material to cause laser ablation; a laser measuring device which is physically attached to the sample chamber to measure a power/energy value of the laser beam; and a material analyzing module that is coupled to the sample chamber to receive the ablated material from laser ablation of the sample material.