Invention Grant
- Patent Title: Signal transmission cable
- Patent Title (中): 信号传输电缆
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Application No.: US14161914Application Date: 2014-01-23
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Publication No.: US09362683B2Publication Date: 2016-06-07
- Inventor: Akira Akiba , Mitsuo Hashimoto , Shinya Morita , Shun Mitarai , Mikihiro Taketomo , Kazunao Oniki , Koichi Ikeda
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2013-030402 20130219
- Main IPC: H02G15/02
- IPC: H02G15/02 ; H01R13/6599 ; H01P3/08 ; H01P3/12 ; H05K1/02

Abstract:
A signal transmission cable has a cable including a dielectric layer and a metallic layer. The signal transmission cable further includes a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.
Public/Granted literature
- US20140235102A1 SIGNAL TRANSMISSION CABLE Public/Granted day:2014-08-21
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