Invention Grant
- Patent Title: Heat dissipation structure applied to mobile device
- Patent Title (中): 散热结构应用于移动设备
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Application No.: US14168546Application Date: 2014-01-30
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Publication No.: US09389656B2Publication Date: 2016-07-12
- Inventor: Chih-Yeh Lin , Chih-Ming Chen
- Applicant: Asia Vital Components Co., Ltd.
- Applicant Address: TW New Taipei
- Assignee: Asia Vital Components Co., Ltd.
- Current Assignee: Asia Vital Components Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Nikolai & Mersereau, P.A.
- Agent C. G. Mersereau
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K5/00 ; H05K7/20
Abstract:
A heat dissipation structure applied to mobile device includes a heat conduction main body. The heat conduction main body has a heat dissipation side and a heat absorption side. A radiation heat dissipation layer is formed on the heat dissipation side. The heat dissipation structure is disposed in the mobile device to provide a very good heat dissipation effect for the closed space of the mobile device by way of natural convection and radiation. Therefore, the heat dissipation performance of the entire mobile device is greatly enhanced.
Public/Granted literature
- US20150212557A1 HEAT DISSIPATION STRUCTURE APPLIED TO MOBILE DEVICE Public/Granted day:2015-07-30
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