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公开(公告)号：US12244196B2
公开(公告)日：2025-03-04
申请号：US18154003
申请日：2023-01-12
Applicant: ASIA VITAL COMPONENTS CO., LTD.
Inventor： Yen-Chih Lu , Ta-Cheng Lee
Abstract: A salt spray resistant structure of fan motor assembly includes a silicon steel sheet assembly, an insulation support assembly and an encapsulation layer. An inner side of the silicon steel sheet assembly defines a connection hole. A winding assembly is wound on the silicon steel sheet assembly and electrically connected with a circuit board. A first extension section protrudes from the silicon steel sheet assembly into the connection hole to cover a part of the inner side. A bearing cup covers the other part of the inner side. The encapsulation layer encapsulates the insulation support assembly, the winding assembly, the silicon steel sheet assembly and the circuit board so as to achieve salt spray resistant effect.
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公开(公告)号：US12180978B2
公开(公告)日：2024-12-31
申请号：US18058738
申请日：2022-11-24
Applicant: ASIA VITAL COMPONENTS CO., LTD.
Inventor： Hua Lai , Ze-Hua Tan
Abstract: A fan frame with noise muffling structure includes a frame having a top and a bottom and defining a centered air flow passage that extends from the top to the bottom. The air flow passage has an air inlet and an air outlet formed on the top and the bottom, respectively. The frame further has a noise muffling zone in at least one area of the frame located between the air flow passage and an outer periphery of the frame. In the noise muffling zone, there is provided at least one noise muffling unit, which is located between the top and the bottom without communicating with the air flow passage. The noise muffling unit internally defines a hollow cavity, which is closed between but not extended through the top and the bottom. The hollow cavity isolates air flow noise and absorbs frame vibration and noise produced by the frame vibration.
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公开(公告)号：US20240402769A1
公开(公告)日：2024-12-05
申请号：US18202960
申请日：2023-05-29
Applicant: ASIA VITAL COMPONENTS CO., LTD.
Inventor： Wen-Ji Lan
Abstract: A heat dissipation unit is connected to a bare die heat source by extending connecting elements through four predetermined corners on the heat dissipation unit. The connecting elements respectively include a screw having a spring fitted therearound; a sleeve defining a receiving space for receiving the screw and the spring therein, and having a window formed near an upper end thereof to radially communicate with the receiving space; and a turnable retaining ring fitted around the upper end of the sleeve and including a tongue curled toward a center of the turnable retaining ring and being extendable through the window into the receiving space to compress the spring. When all the turnable retaining rings are turned, the tongues can be moved away from the springs, allowing the springs to release their elastic force synchronously and push the heat dissipation unit toward the bare die heat source evenly for heat exchange.
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公开(公告)号：US20240347419A1
公开(公告)日：2024-10-17
申请号：US18133505
申请日：2023-04-11
Applicant: ASIA VITAL COMPONENTS CO., LTD.
Inventor： Sheng-Huang Lin , Chii-Ming Leu
IPC: H01L23/40
CPC classification number: H01L23/4006 , H01L2023/4043 , H01L2023/4087
Abstract: A heat dissipation fastener structure includes a support body, a heat sink, a cover body and an operation unit assembly. The support body comprises a window formed on an upper side and support legs extended from a lower side to together define a reciprocating space in communication with the window. The heat sink is formed with perforations at four corners and disposed in the reciprocating space. Threaded locking members, around which elastic members are fitted, are correspondingly passed through the perforations to mount the heat sink above a heat source in a floating state. The cover body is disposed on the support body and comprises at least one vertical folded edge. The operation unit assembly is disposed on the heat sink to drive the cover body to shield the threaded locking members and make the heat sink get close to or away from the heat source.
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公开(公告)号：US12108569B2
公开(公告)日：2024-10-01
申请号：US16867567
申请日：2020-05-06
Applicant: ASIA VITAL COMPONENTS CO., LTD.
Inventor： Ching-Hang Shen
CPC classification number: H05K7/20336 , F28F21/081 , F28F21/083 , F28F21/085
Abstract: A heat dissipation connection structure of handheld device includes an outer frame main body and a two-phase flow heat exchange unit. The outer frame main body has a hollow receiving space at the center. The outer frame main body surrounds the hollow receiving space. The two-phase flow heat exchange unit is disposed in the hollow receiving space and connected with the outer frame main body by means of an injection molding structure member, whereby the outer frame main body and the two-phase flow heat exchange unit can be quickly and securely connected with each other.
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Patent Agency Ranking
公开(公告)号：US20240175638A1
公开(公告)日：2024-05-30
申请号：US18196416
申请日：2023-05-11
Applicant: ASIA VITAL COMPONENTS CO., LTD.
Inventor： Xi-Wen Xiong , Lei Yao , Xing-Xing Lyu
CPC classification number: F28D15/0233 , F28D15/046
Abstract: A 3D vapor chamber includes a vapor chamber and at least one pipe body. The vapor chamber has an upper plate and a lower plate mated with each other. The upper plate is formed with at least one perforation. An open end of the pipe body is outward expanded to form a lip section in connection with the upper plate. A closed end of the pipe body passes through the perforation of the upper plate. The closed end and the open end together define a tubular chamber in communication with the open end and the vapor chamber. Multiple channels formed on an inner side of the tubular chamber and an inner side of the lip section are in contact and connect with a capillary structure of the inner side of the upper plate so as to increase back flowing speed of a working fluid and enhance heat dissipation performance.
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公开(公告)号：US20240162108A1
公开(公告)日：2024-05-16
申请号：US18196413
申请日：2023-05-11
Applicant: ASIA VITAL COMPONENTS CO., LTD.
Inventor： Yuan-Yi Lin , Fu-Kuei Chang
IPC: H01L23/367
CPC classification number: H01L23/3672
Abstract: A knockdown heat sink structure includes a carrier body with a high-temperature section in contact with at least one heat source. A non-high-temperature section of the carrier body has a first radiating fin assembly, while a higher second radiating fin assembly is on the high-temperature section. The second radiating fin assembly has a first part higher than the height of the first radiating fin assembly, and a second part that outward spreads and extends from a top end of the first part and covers the first assembly without touching it, creating a spacing flow way. Therefore, the structure increases the heat dissipation area for the high-temperature section, allowing for faster heat dissipation.
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公开(公告)号：US20230422443A1
公开(公告)日：2023-12-28
申请号：US18172323
申请日：2023-02-22
Applicant: ASIA VITAL COMPONENTS CO., LTD.
Inventor： Sheng-Huang Lin
IPC: H05K7/20
CPC classification number: H05K7/20336
Abstract: A vapor chamber structure includes a main body. The main body has multiple independent heat dissipation blocks. Each of the heat dissipation blocks has an internal independent airtight chamber. A capillary structure is disposed on an inner wall face of the airtight chamber. A working fluid is filled in the airtight chamber. Multiple connection bodies are disposed between the independent heat dissipation blocks to connect the independent heat dissipation blocks with each other. At least one heat insulation penetrating slot is formed between each two adjacent connection bodies to separate the heat dissipation blocks from each other so as to achieve heat insulation effect. By means of the heat insulation penetrating slots formed on the connection bodies, the respectively airtight chambers can independently conduct heat without transferring heat to each other.
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公开(公告)号：US20230422442A1
公开(公告)日：2023-12-28
申请号：US18138126
申请日：2023-04-24
Applicant: ASIA VITAL COMPONENTS CO., LTD.
Inventor： Qian-Cheng Lin
IPC: H05K7/20
CPC classification number: H05K7/20336
Abstract: A support structure of heat dissipation unit is applicable in a heat dissipation unit. Two sides of the heat dissipation unit are respectively formed with a condensation side and an evaporation side. Two ends of the support structure respectively abut against and connect with the condensation side and the evaporation side. The support structure includes a base section and a thorny section. The base section has a contact face and a support face. The thorny section is composed of multiple thorny columns arranged on the support face of the base section in an array. The thorny columns are arranged at intervals, whereby a passage is defined between each two adjacent thorny columns. The support structure with the thorny section serves to speed vapor-liquid circulation in the heat dissipation unit and increase flowing speed of the working fluid so as to greatly enhance heat dissipation performance.
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公开(公告)号：US11832380B2
公开(公告)日：2023-11-28
申请号：US17465787
申请日：2021-09-02
Applicant: ASIA VITAL COMPONENTS CO., LTD.
Inventor： Sung-Wei Sun , Ming-Che Lee
CPC classification number: H05K1/0209 , H05K1/117 , H05K7/20172 , H05K2201/10189
Abstract: A fan structure automatically mountable on a system circuit board includes a fan. The fan includes a fan frame main body. A connector connection section is disposed on the fan frame main body for connecting with a fan end connector, whereby the fan end connector can be assembled with the fan frame main body. Accordingly, when the fan is mounted on the system circuit board, the fan end connector can be directly pressed down by means of an automated device to plug into the circuit board end connector. Therefore, the manufacturing process can be automated.
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