Invention Grant
- Patent Title: Linear ion beam bonding apparatus and array structure thereof
- Patent Title (中): 线性离子束接合装置及其阵列结构
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Application No.: US14389642Application Date: 2013-02-26
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Publication No.: US09406495B2Publication Date: 2016-08-02
- Inventor: Gongyu Jiang , Wenjian Sun
- Applicant: SHIMADZU RESEARCH LABORATORY (SHANGHAI) CO. LTD.
- Applicant Address: CN Shanghai
- Assignee: SHIMADZU RESEARCH LABORATORY (SHANGHAI) CO. LTD.
- Current Assignee: SHIMADZU RESEARCH LABORATORY (SHANGHAI) CO. LTD.
- Current Assignee Address: CN Shanghai
- Agency: Locke Lord LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: CN201210090725 20120330
- International Application: PCT/CN2013/071877 WO 20130226
- International Announcement: WO2013/143369 WO 20131003
- Main IPC: H01J49/42
- IPC: H01J49/42 ; H01J49/06 ; H01J49/00

Abstract:
A linear ion beam bonding apparatus and an array structure thereof, comprising a pair of primary radiofrequency electrodes (501 and 502) extending along the axial direction and oppositely arranged on two sides of the central axis of the linear ion beam bonding apparatus. Section patterns on different section planes of each of the primary radiofrequency electrodes (501 and 502) and perpendicular to the central axis are all kept symmetric via a primary symmetric plane (506) of the central axis. Radiofrequency voltages attached to the primary radiofrequency electrodes (501 and 502) are of identical phases. An ion extraction groove (84) is arranged on at least one of the primary radiofrequency electrodes (501 and 502), while at least one pair of auxiliary electrodes (503 and 505) are arranged on two sides of the pair of primary radiofrequency electrodes (501 and 502). The auxiliary electrodes (503 and 505) are arranged in duality to the primary symmetric plane (506). At least one of the auxiliary electrodes (503 and 505) is provided with a finite number of symmetric planes (507), while a minimal angle greater than 0 degrees and less than 90 degrees is provided between each symmetric plane (507) and the symmetric plane (506) of the primary radiofrequency electrodes (501 and 502). By means of this, a quadrupole field component of an ion beam bonding radiofrequency electric field within the ion beam bonding apparatus is strengthened.
Public/Granted literature
- US20150170898A1 LINER ION BEAM BONDING APPARATUS AND ARRAY STRUCTURE THEREOF Public/Granted day:2015-06-18
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