Invention Grant
- Patent Title: Semiconductor package including an embedded circuit component within a support structure of the package
- Patent Title (中): 半导体封装包括在封装的支撑结构内的嵌入式电路部件
-
Application No.: US14815184Application Date: 2015-07-31
-
Publication No.: US09414497B2Publication Date: 2016-08-09
- Inventor: Jovica Savic , Zhiping Yang , Jie Xue , Li Li
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Edell, Shapiro & Finnan, LLC
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H05K1/18 ; H01L23/498 ; H05K1/11 ; H01L23/24 ; H01L23/31
Abstract:
An apparatus includes a cavity formed in a support structure, the support structure being operable to support a semiconductor device. A circuit element is disposed in the cavity in the support structure, and the cavity in the support structure is filled with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material. The semiconductor device is electrically connected to the circuit element. In an example embodiment, the circuit element is operable to substantially block direct current that is output by the semiconductor device or another semiconductor device.
Public/Granted literature
Information query
IPC分类:
