Invention Grant
- Patent Title: Method for the fabrication of thin-film transistors together with other components on a substrate
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Application No.: US14862504Application Date: 2015-09-23
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Publication No.: US09446946B2Publication Date: 2016-09-20
- Inventor: Patrick Schalberger , Norbert Fruehauf , Marcus Herrmann
- Applicant: UNIVERSITAET STUTTGART
- Applicant Address: DE Stuttgart
- Assignee: Universitaet Stuttgart
- Current Assignee: Universitaet Stuttgart
- Current Assignee Address: DE Stuttgart
- Agent Michael J. Striker
- Priority: DE102014115243 20141020
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/16 ; B81C1/00 ; H01L29/66 ; H01L21/306 ; H01L21/465 ; H01L21/28 ; H01L21/44 ; H01L29/24 ; H01L29/872 ; H01L29/16
Abstract:
A method for the fabrication of thin-film transistors together with micromechanical components, other active electrical components or both on an amorphous or polycrystalline substrate includes disposing the thin-film transistors and the other components on different areas of the substrate.
Public/Granted literature
- US20160107885A1 Method for the fabrication of thin-film transistors together with other components on a substrate Public/Granted day:2016-04-21
Information query
IPC分类:
