Invention Grant
- Patent Title: Tunable temperature controlled substrate support assembly
- Patent Title (中): 可调节温度控制的基板支撑组件
-
Application No.: US14717676Application Date: 2015-05-20
-
Publication No.: US09472435B2Publication Date: 2016-10-18
- Inventor: Vijay D. Parkhe , Steven E. Babayan , Konstantin Makhratchev , Zhiqiang Guo , Phillip R. Sommer , Dan A. Marohl
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: F27B5/14
- IPC: F27B5/14 ; H01L21/683 ; H05B3/02 ; H01L21/67 ; H05B1/02

Abstract:
Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.
Public/Granted literature
- US20160027678A1 TUNABLE TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY Public/Granted day:2016-01-28
Information query