Invention Grant
- Patent Title: Bimodal cooling in modular server system
- Patent Title (中): 双模冷却模块化服务器系统
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Application No.: US14657316Application Date: 2015-03-13
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Publication No.: US09538688B2Publication Date: 2017-01-03
- Inventor: Jean-Philippe Fricker
- Applicant: Advanced Micro Devices, Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Sunnyvale
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/20 ; H05K7/14

Abstract:
A server system includes a plurality of stacked modular computing structures. Each modular computing structure includes a circuit board comprising a computing resource, an air-fluid heat exchange structure comprising a first set of pipe segments, and a cold plate structure attached to a second set of pipe segments of the modular computing structure. The first set of pipe segments of each modular computing structure interfaces with the first set of pipe segments of at least one adjacent modular computing structure to form a corresponding section of a first fluid circulation loop. The second set of pipe segments of each modular computing structure interfaces with the second set of pipe segments of at least one adjacent modular computing structure to form a corresponding section of a second fluid circulation loop.
Public/Granted literature
- US20150334879A1 BIMODAL COOLING IN MODULAR SERVER SYSTEM Public/Granted day:2015-11-19
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