A light-emitting package structure is provided, including an encapsulant, an light-emitting component embedded the encapsulant and having a light-emitting side and a non-emitting side opposing the light-emitting side, a dam embedded and exposed from the encapsulant, and a phosphor layer covering the light-emitting side and the dam. The non-emitting side has a plurality of electrodes. Since the heat generated by the phosphor layer can be transmitted to an outside region of the light-emitting package structure through the dam, the etiolation of the encapsulant can thus be prevented. A method of fabricating the light-emitting package structure is also provided.