Invention Grant
US09581804B1 Liquid dispensing method for manufacturing an electrowetting device
有权
用于制造电润湿装置的液体分配方法
- Patent Title: Liquid dispensing method for manufacturing an electrowetting device
- Patent Title (中): 用于制造电润湿装置的液体分配方法
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Application No.: US14577681Application Date: 2014-12-19
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Publication No.: US09581804B1Publication Date: 2017-02-28
- Inventor: Robin Leguijt
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US WA Seattle
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US WA Seattle
- Agency: EIP US LLP
- Main IPC: G02B26/00
- IPC: G02B26/00 ; G02B26/02 ; B05D1/36 ; B05D3/02 ; B05D3/12 ; G02B26/04 ; G09G3/34

Abstract:
A method of manufacturing an electrowetting device includes dispensing a first liquid on a surface of a support plate and dispensing a second liquid to adjoin the first liquid. The first liquid is a solution. A first portion of the first liquid transfers into the second liquid to form a first layer of liquid and a second layer of liquid substantially immiscible with the first layer. The first layer comprises a second portion of the first liquid and the second layer comprises the second liquid and the first portion.
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