Invention Grant
US09583337B2 Oxygen radical enhanced atomic-layer deposition using ozone plasma
有权
氧自由基增强了使用臭氧等离子体的原子层沉积
- Patent Title: Oxygen radical enhanced atomic-layer deposition using ozone plasma
- Patent Title (中): 氧自由基增强了使用臭氧等离子体的原子层沉积
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Application No.: US14601944Application Date: 2015-01-21
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Publication No.: US09583337B2Publication Date: 2017-02-28
- Inventor: Arthur W. Zafiropoulo
- Applicant: Ultratech, Inc.
- Applicant Address: US CA San Jose
- Assignee: Ultratech, Inc.
- Current Assignee: Ultratech, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Opticus IP Law PLLC
- Main IPC: C23C16/40
- IPC: C23C16/40 ; H01L21/02 ; C23C16/455 ; C23C16/507

Abstract:
A method of performing an oxygen radical enhanced atomic-layer deposition process on a surface of a substrate that resides within an interior of a reactor chamber is disclosed. The method includes forming an ozone plasma to generate oxygen radicals O*. The method also includes feeding the oxygen radicals and a precursor gas sequentially into the interior of the reactor chamber to form an oxide film on the substrate surface. A system for performing the oxygen radical enhanced atomic-layer deposition process is also disclosed.
Public/Granted literature
- US20150279665A1 Oxygen radical enhanced atomic-layer deposition using ozone plasma Public/Granted day:2015-10-01
Information query
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