Invention Grant
US09584134B2 Correcting temperature based oscillation frequency errors in semiconductor device
有权
在半导体器件中校正基于温度的振荡频率误差
- Patent Title: Correcting temperature based oscillation frequency errors in semiconductor device
- Patent Title (中): 在半导体器件中校正基于温度的振荡频率误差
-
Application No.: US14926534Application Date: 2015-10-29
-
Publication No.: US09584134B2Publication Date: 2017-02-28
- Inventor: Kazuya Yamada , Toshihisa Sone , Akihiro Takei , Yuichi Yoshida , Kengo Takemasa
- Applicant: LAPIS Semiconductor Co., Ltd.
- Applicant Address: JP Yokohama
- Assignee: LAPIS SEMICONDUCTOR CO., LTD.
- Current Assignee: LAPIS SEMICONDUCTOR CO., LTD.
- Current Assignee Address: JP Yokohama
- Agency: Rabin & Berdo, P.C.
- Priority: JP2012-104075 20120427
- Main IPC: G01R31/3187
- IPC: G01R31/3187 ; H03L1/02 ; G01R21/00 ; H03L1/04 ; G01R35/04 ; G01R22/10 ; H03K3/011 ; G01R22/06 ; G01R1/44

Abstract:
A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.
Public/Granted literature
- US20160049944A1 SEMICONDUCTOR DEVICE, MEASUREMENT DEVICE, AND CORRECTION METHOD Public/Granted day:2016-02-18
Information query
IPC分类: