Invention Grant
- Patent Title: Patterned conductive structure and method for forming the same
- Patent Title (中): 图案导电结构及其形成方法
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Application No.: US14583446Application Date: 2014-12-26
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Publication No.: US09595754B2Publication Date: 2017-03-14
- Inventor: Babak Radi , Yong-Jyun Lu , Ming-Chi Chiu , Chien-Min Hsu , Shih-Hong Chen
- Applicant: Wistron NeWeb Corp.
- Applicant Address: TW Hsinchu
- Assignee: Wistron NeWeb Corp.
- Current Assignee: Wistron NeWeb Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H05K3/04 ; H05K3/14 ; H05K3/16 ; H05K1/03 ; H05K3/38 ; H01Q1/22
Abstract:
A method for forming a patterned conductive structure is provided. The method includes forming a soluble layer on a surface of a substrate, wherein the soluble layer has an opening exposing a rough portion of the surface. A first conductive layer is formed on the soluble layer, wherein the first conductive layer extends onto the rough portion in the opening. The soluble layer and the first conductive layer on the soluble layer are removed, wherein a portion of the first conductive layer corresponding to the rough portion is remained on the substrate. A patterned conductive structure formed by the method is also provided.
Public/Granted literature
- US20160192482A1 PATTERNED CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2016-06-30
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