Invention Grant
- Patent Title: Thermal-aware compiler for parallel instruction execution in processors
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Application No.: US13976905Application Date: 2013-05-21
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Publication No.: US09639359B2Publication Date: 2017-05-02
- Inventor: Yuan Xie , Junli Gu
- Applicant: Advanced Micro Devices, Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Staniford Tomita LLP
- International Application: PCT/CN2013/075978 WO 20130521
- International Announcement: WO2014/186948 WO 20141127
- Main IPC: G06F9/45
- IPC: G06F9/45 ; G06F9/30 ; G06F9/48

Abstract:
Embodiments are described for a method for compiling instruction code for execution in a processor having a number of functional units by determining a thermal constraint of the processor, and defining instruction words comprising both real instructions and one or more no operation (NOP) instructions to be executed by the functional units within a single clock cycle, wherein a number of NOP instructions executed over a number of consecutive clock cycles is configured to prevent exceeding the thermal constraint during execution of the instruction code.
Public/Granted literature
- US20160098275A1 THERMAL-AWARE COMPILER FOR PARALLEL INSTRUCTION EXECUTION IN PROCESSORS Public/Granted day:2016-04-07
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