Invention Grant
- Patent Title: Flip-flop with delineated layout for reduced footprint
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Application No.: US15143676Application Date: 2016-05-02
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Publication No.: US09641161B1Publication Date: 2017-05-02
- Inventor: Chi-Lin Liu , Ting-Wei Chiang , Jerry Chang-Jui Kao , Hui-Zhong Zhuang , Lee-Chung Lu , Shang-Chih Hsieh , Che Min Huang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H03K3/3562
- IPC: H03K3/3562 ; G01R31/3177 ; G01R31/317

Abstract:
In some embodiments, a flip-flop is laid-out on a flip-flop region of a semiconductor substrate. The flip-flop includes master switch circuitry made of a first plurality of devices which are circumscribed by a master switch perimeter residing within the flip-flop region. Scan mux input circuitry is operably coupled to an input of the master switch circuitry. The scan mux input circuitry is made up of a second plurality of devices that are circumscribed by a scan mux perimeter which resides within the flip-flop region and which is non-overlapping with the master switch perimeter. Slave switch circuitry is operably coupled to an output of the master switch circuitry. The slave switch circuitry is made up of a third plurality of devices that are circumscribed by a slave switch perimeter which resides within the flip-flop region and which is non-overlapping with both the master switch perimeter and the scan mux perimeter.
Information query
IPC分类: