Invention Grant
- Patent Title: High current interconnect system and method for use in a battery module
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Application No.: US14230737Application Date: 2014-03-31
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Publication No.: US09698403B2Publication Date: 2017-07-04
- Inventor: Edward J. Soleski , Richard M. DeKeuster , Bryan L. Thieme , Ronald J. Dulle , Mikhail S. Balk
- Applicant: Johnson Controls Technology Company
- Applicant Address: US MI Holland
- Assignee: Johnson Controls Technology Company
- Current Assignee: Johnson Controls Technology Company
- Current Assignee Address: US MI Holland
- Agency: Fletcher Yoder, P.C.
- Main IPC: H01R9/00
- IPC: H01R9/00 ; H01M2/22 ; B60R16/03 ; H02J7/00 ; G01R31/36 ; H01M10/04 ; H01M10/42 ; H01M10/058 ; H01M2/12 ; H01M2/10 ; H01M2/24 ; H01M2/20 ; H01M2/34 ; H01H47/32 ; H01M10/48 ; H05K1/18 ; H05K3/32 ; B60L11/18 ; H01M2/30 ; H01M10/6551 ; B60L1/00 ; B60L1/02 ; B60L1/14 ; B60L3/00 ; B60L3/12 ; B60L11/12 ; B60L11/14 ; B60L15/20 ; B60R16/033 ; H01R12/71 ; H05K1/02 ; H02H7/18 ; G01R31/02 ; H01M2/32 ; H01M4/66
Abstract:
A printed circuit board (PCB) assembly includes a PCB and a high current interconnect mounted on the PCB. The high current interconnect is configured to electrically couple a first high current bladed component, a second high current bladed component, and a trace disposed on the PCB. The high current interconnect includes feet made of a conductive material that are coupled to the PCB. The trace is coupled to the feet via a weld.
Public/Granted literature
- US20150072196A1 HIGH CURRENT INTERCONNECT SYSTEM AND METHOD FOR USE IN A BATTERY MODULE Public/Granted day:2015-03-12
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