Invention Grant
- Patent Title: Long-term packaging for the protection of implant electronics
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Application No.: US14142180Application Date: 2013-12-27
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Publication No.: US09781842B2Publication Date: 2017-10-03
- Inventor: Yu-Chong Tai , Han-Chieh Chang
- Applicant: California Institute of Technology
- Applicant Address: US CA Pasadena
- Assignee: California Institute of Technology
- Current Assignee: California Institute of Technology
- Current Assignee Address: US CA Pasadena
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01G2/12
- IPC: H01G2/12 ; H05K3/40 ; H01L23/31 ; A61F9/00 ; H05K1/03 ; H05K3/00 ; H05K3/28 ; H05K3/38
Abstract:
The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation material layer configured to encapsulate the micropackaged device.
Public/Granted literature
- US20150036302A1 LONG-TERM PACKAGING FOR THE PROTECTION OF IMPLANT ELECTRONICS Public/Granted day:2015-02-05
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