Invention Grant
- Patent Title: Methods of fabricating low melting point solder reinforced sealant and structures formed thereby
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Application No.: US15017398Application Date: 2016-02-05
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Publication No.: US09808875B2Publication Date: 2017-11-07
- Inventor: Deepak V. Kulkarni , Carl L. Deppisch , Leonel R. Arana , Gregory S. Constable , Sriram Srinivasan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe Williamson & Wyatt P.C.
- Main IPC: B23K31/00
- IPC: B23K31/00 ; B23K31/02 ; B23K1/00 ; B23K3/08 ; B23K1/20 ; H01L23/367
Abstract:
Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.
Public/Granted literature
- US20160151850A1 METHODS OF FABRICATING LOW MELTING POINT SOLDER REINFORCED SEALANT AND STRUCTURES FORMED THEREBY Public/Granted day:2016-06-02
Information query
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