Invention Grant
- Patent Title: Method for manufacturing layered electronic devices
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Application No.: US14333856Application Date: 2014-07-17
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Publication No.: US09832875B2Publication Date: 2017-11-28
- Inventor: Slade R. Culp , Sameh Dardona , Wayde R. Schmidt
- Applicant: Hamilton Sundstrand Corporation
- Applicant Address: US NC Charlotte
- Assignee: Hamilton Sundstrand Corporation
- Current Assignee: Hamilton Sundstrand Corporation
- Current Assignee Address: US NC Charlotte
- Agency: Locke Lord LLP
- Agent Scott D. Wofsy; Joshua L. Jones
- Main IPC: H05K1/16
- IPC: H05K1/16 ; C23C18/16 ; B32B37/06 ; H05K3/12 ; H05K3/36 ; H05K1/02 ; H05K1/09 ; H05K3/46
Abstract:
A method for fabricating printed electronics includes printing a trace of an electrical component on a first substrate to form a first layer. The method further includes printing a trace of an electrical component on at least one additional substrate to form at least one additional layer. The first layer is stacked with the at least one additional layer to create an assembled electrical device. At least one of the layers is modified after printing.
Public/Granted literature
- US20160007462A1 METHOD FOR MANUFACTURING LAYERED ELECTRONIC DEVICES Public/Granted day:2016-01-07
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