-
公开(公告)号：US20180054894A1
公开(公告)日：2018-02-22
申请号：US15802676
申请日：2017-11-03
Applicant: Hamilton Sundstrand Corporation
Inventor： Slade R. Culp , Sameh Dardona , Wayde R. Schmidt
CPC classification number: H05K1/16 , B32B37/06 , B32B2305/72 , C23C18/1633 , H05K1/0298 , H05K1/092 , H05K1/165 , H05K3/12 , H05K3/36 , H05K3/4617 , H05K2201/0125 , H05K2201/0129 , H05K2203/06 , H05K2203/1105
Abstract: A method for fabricating printed electronics includes printing a trace of an electrical component on a first substrate to form a first layer. The method further includes printing a trace of an electrical component on at least one additional substrate to form at least one additional layer. The first layer is stacked with the at least one additional layer to create an assembled electrical device. At least one of the layers is modified after printing.
-
公开(公告)号：US09832875B2
公开(公告)日：2017-11-28
申请号：US14333856
申请日：2014-07-17
Applicant: Hamilton Sundstrand Corporation
Inventor： Slade R. Culp , Sameh Dardona , Wayde R. Schmidt
CPC classification number: H05K1/16 , B32B37/06 , B32B2305/72 , C23C18/1633 , H05K1/0298 , H05K1/092 , H05K1/165 , H05K3/12 , H05K3/36 , H05K3/4617 , H05K2201/0125 , H05K2201/0129 , H05K2203/06 , H05K2203/1105
Abstract: A method for fabricating printed electronics includes printing a trace of an electrical component on a first substrate to form a first layer. The method further includes printing a trace of an electrical component on at least one additional substrate to form at least one additional layer. The first layer is stacked with the at least one additional layer to create an assembled electrical device. At least one of the layers is modified after printing.
-
公开(公告)号：US20160007473A1
公开(公告)日：2016-01-07
申请号：US14333837
申请日：2014-07-17
Applicant: HAMILTON SUNDSTRAND CORPORATION
Inventor： Sameh Dardona , Wayde R. Schmidt , Slade R. Culp
CPC classification number: H05K1/167 , B29C61/003 , B29C61/02 , B29K2025/06 , H01L21/4867 , H01L23/15 , H01L2924/0002 , H05K1/0283 , H05K1/032 , H05K1/034 , H05K1/0393 , H05K1/095 , H05K1/162 , H05K1/165 , H05K2201/0125 , H05K2201/0162 , H05K2201/083 , H05K2203/0271 , H05K2203/105 , H05K2203/1105 , H05K2203/1194 , H01L2924/00
Abstract: A method for fabricating printed electronics and optical components includes printing a trace of electrically conductive, semiconductive or insulating material on a substrate and shrinking the substrate to a target size. The material can include an ink, solution, dispersion, powder, slurry, paste or the like. The step of shrinking can include heating the substrate at a predetermined temperature based on properties of the substrate. The step of shrinking can also include heating the substrate for a predetermined duration based on properties of the substrate. The step of shrinking can also include releasing an external electrical potential used to stretch the substrate during printing. For example, the substrate may decrease in area by at least fifty percent during heating.
Abstract translation: 制造印刷电子学和光学部件的方法包括在衬底上印刷导电，半导体或绝缘材料迹线，并将衬底收缩到目标尺寸。 该材料可以包括油墨，溶液，分散体，粉末，浆料，糊剂等。 收缩的步骤可以包括基于基底的性质在预定温度下加热基底。 收缩步骤还可以包括基于基底的性质将衬底加热预定的持续时间。 收缩的步骤还可以包括在印刷期间释放用于拉伸基板的外部电位。 例如，在加热过程中，衬底的面积减少至少百分之五十。
-
公开(公告)号：US20160007462A1
公开(公告)日：2016-01-07
申请号：US14333856
申请日：2014-07-17
Applicant: Hamilton Sundstrand Corporation
Inventor： Slade R. Culp , Sameh Dardona , Wayde R. Schmidt
CPC classification number: H05K1/16 , B32B37/06 , B32B2305/72 , C23C18/1633 , H05K1/0298 , H05K1/092 , H05K1/165 , H05K3/12 , H05K3/36 , H05K3/4617 , H05K2201/0125 , H05K2201/0129 , H05K2203/06 , H05K2203/1105
Abstract: A method for fabricating printed electronics includes printing a trace of an electrical component on a first substrate to form a first layer. The method further includes printing a trace of an electrical component on at least one additional substrate to form at least one additional layer. The first layer is stacked with the at least one additional layer to create an assembled electrical device. At least one of the layers is modified after printing.
Abstract translation: 一种制造印刷电子器件的方法包括在第一衬底上印刷电子部件的痕迹以形成第一层。 该方法还包括在至少一个附加基底上印刷电子部件的痕迹以形成至少一个附加层。 第一层与至少一个附加层堆叠以形成组装的电气装置。 打印后至少有一层被修改。
-
-
-
Search Results
4
records
(took 0.013 seconds)
