Invention Grant
- Patent Title: Printed circuit board and method of fabricating an element
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Application No.: US15435398Application Date: 2017-02-17
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Publication No.: US09991196B2Publication Date: 2018-06-05
- Inventor: Shu-Ying Huang , Te-Wei Chen , Hsiu-Yuan Chen
- Applicant: Silicon Motion, Inc.
- Applicant Address: TW Jhubei, Hsinchu County
- Assignee: SILICON MOTION, INC.
- Current Assignee: SILICON MOTION, INC.
- Current Assignee Address: TW Jhubei, Hsinchu County
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW105108416A 20160318
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H01L23/498 ; H01L21/48 ; H01L21/56 ; H01L21/78 ; H01L23/31 ; H05K3/00 ; H05K3/24
Abstract:
The present invention provides a printed circuit board fabricated by a Non-Plating Process that includes at least one plating bar disposed around at least one package unit of the printed circuit board. The package unit includes at least one ground line, at least one power line and a plurality of signal lines. The ground line has a first contact pad exposed on a surface of the printed circuit board, and at least one of the ground lines is connected to the plating bar. The power line has a second contact pad exposed on the surface, and at least one of the power lines is connected to the neighboring plating bar. The signal line has a third contact pad exposed on the surface.
Public/Granted literature
- US20170271253A1 PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING AN ELEMENT Public/Granted day:2017-09-21
Information query
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