公开(公告)号：US09991196B2

公开(公告)日：2018-06-05

申请号：US15435398

申请日：2017-02-17

Applicant: Silicon Motion, Inc.

Inventor： Shu-Ying Huang ,  Te-Wei Chen ,  Hsiu-Yuan Chen

IPC: H01L21/00 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H05K3/00 ,  H05K3/24

CPC classification number: H01L23/49838 ,  H01L21/4846 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/49805 ,  H01L24/97 ,  H05K3/0097 ,  H05K3/242 ,  H05K2201/09681 ,  H05K2203/072 ,  H05K2203/0723

Abstract: The present invention provides a printed circuit board fabricated by a Non-Plating Process that includes at least one plating bar disposed around at least one package unit of the printed circuit board. The package unit includes at least one ground line, at least one power line and a plurality of signal lines. The ground line has a first contact pad exposed on a surface of the printed circuit board, and at least one of the ground lines is connected to the plating bar. The power line has a second contact pad exposed on the surface, and at least one of the power lines is connected to the neighboring plating bar. The signal line has a third contact pad exposed on the surface.