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公开(公告)号：KR101224448B1
公开(公告)日：2013-01-21
申请号：KR1020120045188
申请日：2012-04-30
Applicant: (주)파트론
CPC classification number: H04R19/005 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/165 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2224/8592 , H01L2924/10253 , H01L2924/1433 , H01L2924/1461 , H01L2924/157 , H01L2924/15787 , H01L2924/16151 , H01L2924/16251 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: PURPOSE: A sensor package and a manufacturing method thereof are provided to simplify manufacturing method by attaching an alien inflow preventing material to the top surface of inner side of the can type cover of monolayer. CONSTITUTION: An acoustic hole(122) applying an acoustic signal from outside to inside arranges in the front side of a cover(120). An alien inflow preventing material(130) is attached to an inner side of the cover. The alien inflow preventing material prevents an inflow of alien materials from the acoustic hole. A MEMS microphone(100) comprises a substrate(110), a MEMS transducer(140), a semiconductor circuitry element(150), and an alien inflow preventing material. The substrate is formed with a semiconductor substrate and a ceramic substrate, etc.
Abstract translation: 目的：提供一种传感器封装及其制造方法，以通过将外来流入防止材料附接到单层罐式盖的内侧的顶表面来简化制造方法。 构成：从外部到内部施加声学信号的声孔（122）布置在盖（120）的前侧。 异物流入防止材料（130）附接到盖子的内侧。 异物流入防止材料防止异物从声孔流入。 MEMS麦克风（100）包括基板（110），MEMS换能器（140），半导体电路元件（150）和外来流入防止材料。 基板由半导体基板和陶瓷基板等形成
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公开(公告)号：KR1020120074610A
公开(公告)日：2012-07-06
申请号：KR1020100136500
申请日：2010-12-28
Applicant: (주)파트론
CPC classification number: H04R19/016 , H04R1/04 , H04R2201/003 , H04R2499/11
Abstract: PURPOSE: A housing apparatus for a MEMS(Micro Electro Mechanical System) condenser microphone is provided to control a frequency response curve by controlling each wavelength sound volume of an acoustic signal coming into a microphone. CONSTITUTION: A first acoustic guide(202) is formed in a region adjacent to an acoustic hole(201) formed on a certain region of a holder cap(200). A secondary hole or secondary molding is used in order to change the wavelength of an acoustic signal entering inside the remaining region of the holder cap through the acoustic hole. A second acoustic guide(203) is formed in the region which is symmetrical with the first acoustic guide. The first acoustic guide and the second acoustic guide are formed at a lower portion of the holder cap into a groove shape having a constant thickness. The size of the first acoustic guide and the second acoustic guide can be formed to be identical or different.
Abstract translation: 目的：提供一种用于MEMS（微机电系统）电容式麦克风的外壳装置，用于通过控制进入麦克风的声信号的每个波长音量来控制频率响应曲线。 构成：第一声导体（202）形成在与形成在保持器盖（200）的某一区域上的声孔（201）相邻的区域中。 为了通过声孔改变进入保持器盖的剩余区域内的声信号的波长，使用二次孔或二次成型。 在与第一声导体对称的区域中形成第二声导体（203）。 第一声引导件和第二声引导件形成为具有恒定厚度的槽形状的保持器盖的下部。 第一声引导件和第二声引导件的尺寸可以形成为相同或不同。
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公开(公告)号：KR101171354B1
公开(公告)日：2012-08-10
申请号：KR1020100136500
申请日：2010-12-28
Applicant: (주)파트론
Abstract: 본 발명은 마이크로폰 하우징 기구에 있어서, 상기 마이크로폰을 구성하는 음향 소자들이 실장되는 인쇄회로기판(PCB); 및 상기 음향 소자들을 덮을 수 있도록 일면은 개구된 형태로 개구면의 하부면은 상기 인쇄회로기판(PCB)에 접착되고, 타면의 일정 영역에는 상기 마이크로폰 내부로 음향 신호를 인가하기 위한 음향 홀이 형성된 홀더 캡을 포함하되, 상기 홀더 캡의 하부면의 일정 영역에는 상기 음향 홀을 통해 들어오는 음향 신호의 특정 파장의 주파수 응답을 변형하기 위한 하나 이상의 보조 형상이 형성된 것으로, 음향 신호의 간섭현상을 이용하여 주파수 응답 특성을 향상시키기 위한 것이다.
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