公开(公告)号：KR101152317B1

公开(公告)日：2012-06-11

申请号：KR1020110013571

申请日：2011-02-16

Applicant: 광전자정밀주식회사

Inventor： 박성림 ,  이현희 ,  임정택

IPC: H01L21/66 ,  H01L21/20 ,  H01L21/02

Abstract: PURPOSE: An electrode material coating apparatus is provided to improve test efficiency by accurately attaching an electrode material with a predetermined size on a desired position. CONSTITUTION: An electrode material(E) is fixed on an epitaxial wafer(W) for testing light emission properties. A mask jig(110) is aligned on a position for fixing the electrode material on the epitaxial wafer. A wafer mounting groove(112) is located on the lower surface of the mask jig. A compression bonding jig(120) is fixed on the epitaxial wafer by attaching the electrode material aligned by the mask jig. The compression bonding jig comprises a compression bonding rod(122) for attaching and pressurizing the electrode material inserted into an alignment hole(114).

Abstract translation: 目的：提供一种电极材料涂覆装置，通过将预定尺寸的电极材料精确地附着在期望的位置上来提高测试效率。 构成：电极材料（E）固定在外延晶片（W）上，用于测试发光性能。 掩模夹具（110）对准用于将电极材料固定在外延晶片上的位置。 晶片安装槽（112）位于掩模夹具的下表面上。 通过安装由掩模夹具对准的电极材料，将压接夹具（120）固定在外延晶片上。 压接夹具包括用于将插入对准孔（114）中的电极材料附接和加压的压接杆（122）。