열전도를 이용한 반도체 검사용 콘택트 핑거의 국부 코팅 방법
    1.
    发明授权
    열전도를 이용한 반도체 검사용 콘택트 핑거의 국부 코팅 방법 有权
    使用热导率测试半导体的接触指示器的局部涂覆方法

    公开(公告)号:KR101334132B1

    公开(公告)日:2013-11-28

    申请号:KR1020120155777

    申请日:2012-12-28

    Abstract: A local coating method of a contact finger for testing a semiconductor is disclosed. The local coating method of a contact finger for testing a semiconductor by one embodiment of the invention comprises a first step of selectively heating the central part while transferring multiple contact fingers with a bent part on the central part in row; a second step of forming a coating part on the whole surface of the contact finger by dipping the contact finger in a coating solution container in which a coating solution is contained and performing dip-coating; and a third step of removing both ends of the coating part.

    Abstract translation: 公开了一种用于测试半导体的接触手指的局部涂覆方法。 通过本发明的一个实施例的用于测试半导体的接触指示器的局部涂覆方法包括:第一步骤,在将多个接触指状物与中心部分上的弯曲部分一起传送的同时,选择性地加热中心部分; 通过将接触指浸入其中包含涂布溶液并进行浸涂的涂布溶液容器中,在接触指的整个表面上形成涂布部分的第二步骤; 以及除去涂布部的两端的第3工序。

    액상공정을 이용한 반도체 검사용 콘택트 핑거의 절연 코팅 방법
    2.
    发明授权
    액상공정을 이용한 반도체 검사용 콘택트 핑거의 절연 코팅 방법 有权
    使用液体过程测试半导体的接触指针绝缘涂层方法

    公开(公告)号:KR101359358B1

    公开(公告)日:2014-02-10

    申请号:KR1020120155779

    申请日:2012-12-28

    Abstract: An insulation coating method of a contact finger for testing a semiconductor using a liquid process is disclosed. According to an embodiment of the present invention, an insulation coating method of a contact finger for testing a semiconductor includes a first step for forming a coating part at one end and the center of a contact finger by partially dipping the contact finer with a central bent part into a coating liquid inside a coating liquid container for dip-coating; and a second step for removing the coating part from one end of the contact finger by dipping one end of the contact finger into an etching liquid.

    Abstract translation: 公开了一种使用液体工艺测试半导体的接触指针的绝缘涂覆方法。 根据本发明的实施例,用于测试半导体的接触指状物的绝缘涂覆方法包括:第一步骤,用于通过将接触细微部分地浸渍在中心弯曲部分中来形成接触指状物的一端和接触指中心处的涂覆部分 部分放入用于浸涂的涂布液容器内的涂布液; 以及通过将接触指针的一端浸入蚀刻液中而从接触指的一端去除涂布部分的第二步骤。

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