公开(公告)号：KR101988890B1

公开(公告)日：2019-10-01

申请号：KR1020120121515

申请日：2012-10-30

Applicant: 한국전자통신연구원

Inventor： 최광성 ,  배호은 ,  배현철 ,  엄용성 ,  전수정

IPC: H01L21/60

公开(公告)号：KR1020140056668A

公开(公告)日：2014-05-12

申请号：KR1020120121515

申请日：2012-10-30

Applicant: 한국전자통신연구원

Inventor： 최광성 ,  배호은 ,  배현철 ,  엄용성 ,  전수정

IPC: H01L21/60

CPC classification number: B23K1/20 ,  B23K3/0623 ,  H01L24/11 ,  H01L2224/11005 ,  H01L2224/1134 ,  H01L2224/1152 ,  H01L2924/00014

Abstract: Disclosed is a manufacturing method for a solder-on-pad. The manufacturing method comprises a step of producing a substrate having a pad; a step of forming a solder bump maker including a resin and solder power, on the substrate; a step of collecting the solder power on the pad by heating the solder bump maker at a temperature lower than the melting point of the solder power; and a step of removing the resin.

Abstract translation: 公开了一种焊接焊盘的制造方法。 该制造方法包括制造具有垫的基板的步骤; 在基板上形成包括树脂和焊料功率的焊料凸块制造器的步骤; 通过在低于焊料功率的熔点的温度下加热焊料块制造器来收集焊盘上的焊料功率的步骤; 和除去树脂的步骤。