公开(公告)号：US20220282138A1

公开(公告)日：2022-09-08

申请号：US17687733

申请日：2022-03-07

Applicant: DENSO CORPORATION ,  ADEKA CORPORATION

Inventor： Kazuma YAMAGUCHI ,  Takao IZUMI ,  Keisuke OTA ,  Kohei HIRAYAMA ,  Shinsuke YAMADA ,  Ryo OGAWA

IPC: C09J163/00 ,  C09J11/04 ,  C09J11/06

Abstract: There is provided a photocurable adhesive having good deep-section curability. A photocurable adhesive is formulated to be curable by laser light irradiation. The photocurable adhesive contains an epoxy adhesive component and titanium black. The content of the titanium black is 1 ppm by mass or more and 150 ppm by mass or less relative to 100 parts by mass of the epoxy adhesive component. The titanium black may have a primary particle size of 5 nm or more and 150 nm or less.

公开(公告)号：US20240141095A1

公开(公告)日：2024-05-02

申请号：US18547092

申请日：2022-02-08

Applicant: ADEKA CORPORATION

Inventor： Keisuke OTA ,  Kohei HIRAYAMA ,  Ryo OGAWA ,  Shinsuke YAMADA

IPC: C08G59/24 ,  C08G59/32 ,  C08G59/34 ,  C08G59/50 ,  C08G59/56 ,  C08K3/36 ,  C08K5/5419 ,  C08L61/14 ,  C09J163/08

CPC classification number: C08G59/245 ,  C08G59/3227 ,  C08G59/34 ,  C08G59/502 ,  C08G59/56 ,  C08K3/36 ,  C08K5/5419 ,  C08L61/14 ,  C09J163/08 ,  C08K2201/005 ,  C08L2205/025 ,  C08L2205/035

Abstract: Disclosed is a curable resin composition containing: (A) a cyanate ester resin; (B) an epoxy resin essentially including at least a 4-amino-3-methylphenol-type epoxy resin; and (C) a latent curing agent. Preferably, the cyanate ester resin (A) is at least one selected from the group consisting of compounds represented by formula (1) below, compounds represented by formula (2) below, and at least one of polymer of these compounds. Formula (1): NC—O-A1-Y1-A2-O—CN (See the Description for the symbols in the formula). Formula (2): (See the Description for the symbols in the formula).

公开(公告)号：US20240141094A1

公开(公告)日：2024-05-02

申请号：US18547066

申请日：2022-02-08

Applicant: ADEKA CORPORATION

Inventor： Kohei HIRAYAMA ,  Keisuke OTA ,  Ryo OGAWA ,  Shinsuke YAMADA

IPC: C08G59/24 ,  C08G59/28 ,  C08G59/34 ,  C08G59/50 ,  C08G59/56 ,  C08K3/08 ,  C08K3/36 ,  C08L61/14 ,  C09J163/08

CPC classification number: C08G59/245 ,  C08G59/28 ,  C08G59/34 ,  C08G59/502 ,  C08G59/56 ,  C08K3/08 ,  C08K3/36 ,  C08L61/14 ,  C09J163/08 ,  C08K2003/0812 ,  C08K2201/003 ,  C08L2205/025 ,  C08L2205/035

Abstract: A curing resin composition including (A) a cyanate ester resin, (B) an epoxy resin, (C) an active hydrogen-containing amine latent curing agent, and (D) an ion scavenger. The cyanate ester resin (A) is preferably at least one of a compound of formula (1) below, a compound of formula (2) below, and a polymer of at least one of these compounds (1) and (2).


NC—O-A1-Y1-A2-O—CN  (1)

wherein the symbols are as defined in the description.






wherein the symbols are as defined in the description.

公开(公告)号：US20210380749A1

公开(公告)日：2021-12-09

申请号：US17288372

申请日：2019-11-07

Applicant: ADEKA CORPORATION

Inventor： Keisuke OTA ,  Masato INADOME ,  Yukako ISHIGAMI ,  Ryo OGAWA ,  Tamotsu NAGAMATSU

IPC: C08G18/00 ,  C08G18/48 ,  C09J175/08 ,  C08G18/10 ,  C08G18/28

Abstract: Disclosed is a structural material-bonding adhesive capable of bonding materials other than iron, and maintaining the bonding ability in an environment at a high temperature and a low temperature, while maintaining performance similar to that of a structural material adhesive used as an adhesive for bonding iron materials. A curable resin composition contains an epoxy resin, blocked urethane, and an amine-based latent curing agent, wherein the blocked urethane is obtained by reacting a urethane polymer having a terminal isocyanate group with a blocking agent, the urethane polymer being obtained by reacting a polyisocyanate, a diol, and a branching agent containing at least three groups that react with an isocyanate group.

公开(公告)号：US20190249047A1

公开(公告)日：2019-08-15

申请号：US16319352

申请日：2017-06-13

Applicant: ADEKA CORPORATION

Inventor： Mitsunori IDE ,  Keisuke OTA ,  Tamotsu NAGAMATSU

IPC: C09J163/00

CPC classification number: C09J163/00 ,  C08G18/58 ,  C08G18/80 ,  C08G59/14 ,  C08G59/20 ,  C09J11/06 ,  C09J175/04

Abstract: To show a curable resin composition suitable as an adhesive for bonding a structural material having good adhesiveness to aluminum in particular. A curable resin composition containing (A1) phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (a1) and an epoxy compound (a2) (excluding a urethane-modified epoxy resin and a urethane-modified chelate epoxy resin); and (A2) an epoxy resin (excluding component (A1)); (B) a block urethane; and (C) a latent curing agent, in which a phosphorus content in a total mass of component (A1) and component (A2) is 0.01 to 2.0% by mass.

公开(公告)号：US20220289973A1

公开(公告)日：2022-09-15

申请号：US17632641

申请日：2020-09-02

Applicant: ADEKA CORPORATION

Inventor： Keisuke OTA ,  Kohei HIRAYAMA ,  Shinsuke YAMADA ,  Ryo OGAWA

IPC: C08L79/04

Abstract: A curable resin composition having fast-curing properties, high heat resistance, and excellent infiltration properties. The composition contains: a cyanate ester resin, an epoxy resin, a latent curing agent, and an inorganic pigment containing at least one metal selected from titanium, iron, copper, chromium, zirconium, calcium, manganese, and zinc. The inorganic pigment preferably has a primary particle size of 5 to 150 nm. The inorganic pigment is preferably present in an amount of 0.01 to 10 parts by mass per 100 parts by mass of the sum of the cyanate ester resin and the epoxy resin.

公开(公告)号：US20220282139A1

公开(公告)日：2022-09-08

申请号：US17687728

申请日：2022-03-07

Applicant: DENSO CORPORATION ,  ADEKA CORPORATION

Inventor： Kazuma YAMAGUCHI ,  Takao IZUMI ,  Keisuke OTA ,  Kohei HIRAYAMA ,  Shinsuke YAMADA ,  Ryo OGAWA

IPC: C09J175/04 ,  C09J11/04 ,  C08G18/00

Abstract: There is provided a photocurable adhesive which is capable of reducing the amount of gas discharged from the cured product. A photocurable adhesive is formulated to be curable by laser light irradiation, The photocurable adhesive contains an epoxy adhesive component, and a light-absorbing component configured to generate heat by laser light irradiation. The epoxy adhesive component contains a cyanate ester resin (A), epoxy resin (B), latent amine curing agent (C), and ion scavenger (D)