公开(公告)号：US20200264520A1

公开(公告)日：2020-08-20

申请号：US16864456

申请日：2020-05-01

Applicant: ASML Netherlands B.V.

Inventor： Alexander YPMA ,  Jasper MENGER ,  David DECKERS ,  David HAN ,  Adrianus Cornelis Matheus KOOPMAN ,  Irina LYULINA ,  Scott Anderson MIDDLEBROOKS ,  Richard Johannes Franciscu VAN HAREN ,  Jochem Sebastiaan WILDENBERG

IPC: G03F7/20 ,  G03F9/00 ,  G06F16/26

Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.

公开(公告)号：US20190278188A1

公开(公告)日：2019-09-12

申请号：US16351873

申请日：2019-03-13

Applicant: ASML Netherlands B.V.

Inventor： Alexander YPMA ,  Jasper MENGER ,  David DECKERS ,  David HAN ,  Adrianus Cornelis Matheus KOOPMAN ,  Irina LYULINA ,  Scott Anderson MIDDLEBROOKS ,  Richard Johannes Franciscus VAN HAREN ,  Jochem Sebastiaan WILDENBERG

IPC: G03F7/20 ,  G06F16/26 ,  G03F9/00

Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.

公开(公告)号：US20160327870A1

公开(公告)日：2016-11-10

申请号：US15105517

申请日：2014-11-07

Applicant: ASML Netherlands B.V.

Inventor： Kyu Kab RHE ,  David DECKERS ,  Hubertus Johannes Gertrudus SIMONS ,  Thomas THEEUWES

IPC: G03F7/20

CPC classification number: G03F7/70616 ,  G03F7/70625 ,  G03F7/70633

Abstract: A method of correcting an image characteristic of a substrate onto which one or more product features have been formed using a lithographic process, and an associated inspection apparatus method. The method includes measuring an error in the image characteristic of the substrate, and determining a correction for a subsequent formation of the product features based upon the measured error and a characteristic of one or more of the product feature(s).

Abstract translation: 使用光刻工艺校正已经形成了一个或多个产品特征的基板的图像特性的方法以及相关联的检查装置方法。 该方法包括测量衬底的图像特性中的误差，以及基于所测量的误差和一个或多个产品特征的特性来确定随后形成产品特征的校正。

公开(公告)号：US20150261100A1

公开(公告)日：2015-09-17

申请号：US14725023

申请日：2015-05-29

Applicant: ASML Netherlands B.V.

Inventor： Franciscus Godefridus Casper BIJNEN ,  David DECKERS ,  Sami MUSA

IPC: G03F7/20 ,  G01B9/02 ,  G01B11/27

CPC classification number: G03F7/70141 ,  G01B9/02 ,  G01B11/272 ,  G01D5/344 ,  G03F9/7046 ,  G03F9/7088

Abstract: An alignment measurement system measures an alignment target on an object. A measurement illuminates the target and is reflected. The reflected measurement beam is split and its parts are differently polarized. A detector receives the reflected measurement beam. A processing unit determines alignment on the basis of the measurement beam received by the detector. An alternative arrangement utilizes an optical dispersive fiber to guide a multi-wavelength measurement beam reflected from the object to a detector.

Abstract translation: 对准测量系统测量物体上的对准目标。 测量照亮目标并被反射。 反射的测量光束被分离，其部分被不同的极化。 检测器接收反射的测量光束。 处理单元基于由检测器接收的测量波束来确定对准。 一种替代方案是使用光学色散光纤将从物体反射的多波长测量光束引导到检测器。

公开(公告)号：US20220326623A1

公开(公告)日：2022-10-13

申请号：US17836099

申请日：2022-06-09

Applicant: ASML Netherlands B.V.

Inventor： Alexander YPMA ,  Jasper MENGER ,  David DECKERS ,  David HAN ,  Adrianus Cornelis Matheus KOOPMAN ,  Irina LYULINA ,  Scott Anderson MIDDLEBROOKS ,  Richard Johannes Franciscus VAN HAREN ,  Jochem Sebastiaan WILDENBERG

IPC: G03F7/20

Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.