公开(公告)号：SG11201605469PA

公开(公告)日：2016-08-30

申请号：SG11201605469P

申请日：2015-01-06

Applicant: BREWER SCIENCE INC

Inventor： BAI DONGSHUN ,  XU GU ,  BLUMENSHINE DEBBIE

IPC: H01L21/58

Abstract: The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.

公开(公告)号：EP3092658A4

公开(公告)日：2017-07-05

申请号：EP15735186

申请日：2015-01-06

Applicant: BREWER SCIENCE INC

Inventor： BAI DONGSHUN ,  XU GU ,  BLUMENSHINE DEBBIE

IPC: H01L21/58 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/28 ,  B32B27/32 ,  H01L21/683

CPC classification number: H01L21/6835 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/283 ,  B32B27/325 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2457/14 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381