Photosensitive resin compositions for color filter applications

    公开(公告)号:AU4752901A

    公开(公告)日:2002-02-25

    申请号:AU4752901

    申请日:2001-03-15

    Abstract: New polymers, compositions comprising these polymers, and methods of using these compositions are provided. The polymers comprise styrene and maleic anhydride monomers with at least some of the maleic anhydride monomers having certain functional groups bonded thereto. Preferred functional groups include those derived from adhesion promoters (e.g., 2-aminophenol), photoinitiators (e.g., 4-aminoacetophenone), and solubilizers (e.g., 4-aminobenzoic acid). The polymers can be incorporated according to conventional processes into compositions which are then used to form a color filter to be used in a liquid crystal display. The final color filter has a high resolution, is highly resistant to solvents typically used in the color filter manufacturing process, is strongly adhered to the color filter substrate, has superior optical clarity, is highly soluble in a wide range of alkali developers, and has excellent heat and UV light stability.

    ACID-ETCH RESISTANT, PROTECTIVE COATINGS

    公开(公告)号:SG175217A1

    公开(公告)日:2011-11-28

    申请号:SG2011074903

    申请日:2010-03-19

    Abstract: New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.

    CYCLIC OLEFIN POLYMER COMPOSITIONS AND POLYSILOXANE RELEASE LAYERS FOR USE IN TEMPORARY WAFER BONDING PROCESSES

    公开(公告)号:SG11201605469PA

    公开(公告)日:2016-08-30

    申请号:SG11201605469P

    申请日:2015-01-06

    Abstract: The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.

    ACID-ETCH RESISTANT, PROTECTIVE COATINGS

    公开(公告)号:SG2014012512A

    公开(公告)日:2014-06-27

    申请号:SG2014012512

    申请日:2010-03-19

    Abstract: New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.

    7.
    发明专利
    未知

    公开(公告)号:DE60315177T2

    公开(公告)日:2008-04-10

    申请号:DE60315177

    申请日:2003-05-13

    Abstract: New anti-reflective or fill compositions having improved flow properties are provided. The compositions comprise a styrene-allyl alcohol polymer and preferably at least one other polymer (e.g., cellulosic polymers) in addition to the styrene-allyl alcohol polymer. The inventive compositions can be used to protect contact or via holes from degradation during subsequent etching in the dual damascene process. The inventive compositions can also be applied to substrates (e.g., silicon wafers) to form anti-reflective coating layers having high etch rates which minimize or prevent reflection during subsequent photoresist exposure and developing.

    8.
    发明专利
    未知

    公开(公告)号:DE60315177D1

    公开(公告)日:2007-09-06

    申请号:DE60315177

    申请日:2003-05-13

    Abstract: New anti-reflective or fill compositions having improved flow properties are provided. The compositions comprise a styrene-allyl alcohol polymer and preferably at least one other polymer (e.g., cellulosic polymers) in addition to the styrene-allyl alcohol polymer. The inventive compositions can be used to protect contact or via holes from degradation during subsequent etching in the dual damascene process. The inventive compositions can also be applied to substrates (e.g., silicon wafers) to form anti-reflective coating layers having high etch rates which minimize or prevent reflection during subsequent photoresist exposure and developing.

    9.
    发明专利
    未知

    公开(公告)号:AT368060T

    公开(公告)日:2007-08-15

    申请号:AT03809914

    申请日:2003-05-13

    Abstract: New anti-reflective or fill compositions having improved flow properties are provided. The compositions comprise a styrene-allyl alcohol polymer and preferably at least one other polymer (e.g., cellulosic polymers) in addition to the styrene-allyl alcohol polymer. The inventive compositions can be used to protect contact or via holes from degradation during subsequent etching in the dual damascene process. The inventive compositions can also be applied to substrates (e.g., silicon wafers) to form anti-reflective coating layers having high etch rates which minimize or prevent reflection during subsequent photoresist exposure and developing.

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