公开(公告)号：JP2013014777A

公开(公告)日：2013-01-24

申请号：JP2012196932

申请日：2012-09-07

Applicant: Brewer Science Inc ,  ブルーワー サイエンス アイ エヌ シー.

Inventor： HONG WENBIN ,  BAI DONGSHUN ,  FLAIM TONY D ,  PULIGADDA RAMA

IPC: C09J5/00

CPC classification number: H01L21/187 ,  C08G2261/332 ,  C08G2261/418 ,  C08L65/00 ,  C09J123/0823 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T156/1153 ,  Y10T428/24355 ,  Y10T428/24802

Abstract: PROBLEM TO BE SOLVED: To provide new compositions and methods of using those compositions as bonding compositions.SOLUTION: The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.

Abstract translation: 要解决的问题：提供使用这些组合物作为粘合组合物的新组合物和方法。 解决方案：组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于将活性晶片结合到载体晶片或基底，以帮助在随后的处理和处理期间保护活性晶片及其活性位点 。 组合物形成化学和耐热的粘合层，但是也可以软化或溶解以允许晶片在制造过程中的适当阶段滑动或拉开。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：SG185250A1

公开(公告)日：2012-11-29

申请号：SG2012069340

申请日：2009-10-22

Applicant: BREWER SCIENCE INC

Inventor： HONG WENBIN ,  BAI DONGSHUN ,  FLAIM TONY D ,  PULIGADDA RAMA

Abstract: CYCLIC OLEFIN COMPOSITIONS FOR TEMPORARY WAFER BONDING AbstractNew compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.Figure 1

公开(公告)号：SG11201700478YA

公开(公告)日：2017-02-27

申请号：SG11201700478Y

申请日：2015-07-22

Applicant: BREWER SCIENCE INC

Inventor： LIU XIAO ,  BAI DONGSHUN ,  FLAIM TONY D ,  ZHONG XING-FU ,  WU QI

IPC: H01L21/58

Abstract: The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.

公开(公告)号：SG11202005465SA

公开(公告)日：2020-07-29

申请号：SG11202005465S

申请日：2018-12-21

Applicant: BREWER SCIENCE INC

Inventor： LIU XIAO ,  WU QI ,  PULIGADDA RAMA ,  BAI DONGSHUN ,  HUANG BARON

IPC: B32B7/06 ,  B32B27/20 ,  B32B27/28 ,  C09J5/04 ,  C09J11/06 ,  C09J171/08 ,  H01L21/18 ,  H01L21/268 ,  H01L23/00

Abstract: Novel thermoplastic polyhydroxyether-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are soluble in commonly-used organic solvents (e.g., cyclopentanone). The compositions can also be used as build-up layers for RDL formation.

公开(公告)号：SG11201605469PA

公开(公告)日：2016-08-30

申请号：SG11201605469P

申请日：2015-01-06

Applicant: BREWER SCIENCE INC

Inventor： BAI DONGSHUN ,  XU GU ,  BLUMENSHINE DEBBIE

IPC: H01L21/58

Abstract: The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.

公开(公告)号：WO2010051212A2

公开(公告)日：2010-05-06

申请号：PCT/US2009061633

申请日：2009-10-22

Applicant: BREWER SCIENCE INC ,  HONG WENBIN ,  BAI DONGSHUN ,  FLAIM TONY D ,  PULIGADDA RAMA

Inventor： HONG WENBIN ,  BAI DONGSHUN ,  FLAIM TONY D ,  PULIGADDA RAMA

IPC: H01L21/302 ,  H01L21/304

CPC classification number: H01L21/187 ,  C08G2261/332 ,  C08G2261/418 ,  C08L65/00 ,  C09J123/0823 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T156/1153 ,  Y10T428/24355 ,  Y10T428/24802

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.

Abstract translation: 提供了使用这些组合物作为粘合组合物的新组合物和方法。 所述组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于将活性晶片结合到载体晶片或衬底上，以辅助在后续处理和处理期间保护活性晶片及其活性部位。 该组合物形成化学和耐热的粘合层，但也可以软化或溶解以允许晶片在制造过程中的适当阶段滑动或拉开。

公开(公告)号：WO2016014648A3

公开(公告)日：2016-05-19

申请号：PCT/US2015041505

申请日：2015-07-22

Applicant: BREWER SCIENCE INC

Inventor： LIU XIAO ,  BAI DONGSHUN ,  FLAIM TONY D ,  ZHONG XING-FU ,  WU QI

IPC: H01L21/58

CPC classification number: B32B7/06 ,  B05D3/007 ,  B32B27/06 ,  B32B37/14 ,  B32B2255/26 ,  B32B2307/412 ,  B32B2405/00 ,  B32B2457/00 ,  C08G73/1014 ,  C08G73/1039 ,  C08G73/1067 ,  C09D179/08 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1158 ,  Y10T156/1917

Abstract: The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250°C to about 350°C for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.

Abstract translation: 本发明广泛地涉及在微电子制造过程中能够进行薄晶片处理的剥离层组合物。 优选的释放层由包含溶解或分散在溶剂体系中的聚酰胺酸或聚酰亚胺的组合物形成，随后在约250℃至约350℃下固化和/或除去溶剂小于约10分钟，产生薄膜 。 该过程将释放组合物形成聚酰亚胺释放层，其可以用于临时粘合过程，并且在期望的处理已经进行之后激光剥离。

公开(公告)号：EP3172762A4

公开(公告)日：2018-02-28

申请号：EP15824894

申请日：2015-07-22

Applicant: BREWER SCIENCE INC

Inventor： LIU XIAO ,  BAI DONGSHUN ,  FLAIM TONY D ,  ZHONG XING-FU ,  WU QI

IPC: H01L21/683 ,  C08G73/10 ,  C09D179/08 ,  H01L21/58

CPC classification number: B32B7/06 ,  B05D3/007 ,  B32B27/06 ,  B32B37/14 ,  B32B2255/26 ,  B32B2307/412 ,  B32B2405/00 ,  B32B2457/00 ,  C08G73/1014 ,  C08G73/1039 ,  C08G73/1067 ,  C09D179/08 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1158 ,  Y10T156/1917

Abstract: The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.

公开(公告)号：EP3092658A4

公开(公告)日：2017-07-05

申请号：EP15735186

申请日：2015-01-06

Applicant: BREWER SCIENCE INC

Inventor： BAI DONGSHUN ,  XU GU ,  BLUMENSHINE DEBBIE

IPC: H01L21/58 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/28 ,  B32B27/32 ,  H01L21/683

CPC classification number: H01L21/6835 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/283 ,  B32B27/325 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2457/14 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

公开(公告)号：EP2362970A4

公开(公告)日：2013-05-29

申请号：EP09824030

申请日：2009-10-22

Applicant: BREWER SCIENCE INC

Inventor： HONG WENBIN ,  BAI DONGSHUN ,  FLAIM TONY D ,  PULIGADDA RAMA

IPC: H01L21/302 ,  C08L65/00 ,  C09J123/08 ,  H01L21/304 ,  H01L21/683

CPC classification number: H01L21/187 ,  C08G2261/332 ,  C08G2261/418 ,  C08L65/00 ,  C09J123/0823 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T156/1153 ,  Y10T428/24355 ,  Y10T428/24802

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.