公开(公告)号：WO2017222969A1

公开(公告)日：2017-12-28

申请号：PCT/US2017/038105

申请日：2017-06-19

Applicant: BUTTERFLY NETWORK, INC.

Inventor： ROTHBERG, Jonathan M. ,  ALIE, Susan A. ,  ZAHORIAN, Jaime Scott ,  CRISTMAN, Paul Francis ,  FIFE, Keith G.

IPC: B06B1/02 ,  A61B8/12 ,  A61B8/14 ,  B06B1/06 ,  G01S15/89 ,  H01R4/02 ,  H01R12/51

Abstract: An ultrasound-on-a-chip device has an ultrasonic transducer substrate with plurality of transducer cells, and an electrical substrate. For each transducer cell, one or more conductive bond connections are disposed between the ultrasonic transducer substrate and the electrical substrate. Examples of electrical substrates include CMOS chips, integrated circuits including analog circuits, interposers and printed circuit boards.

Abstract translation: 芯片上超声波装置具有带有多个换能器单元的超声换能器基板和电基板。 对于每个换能器单元，在超声换能器基板和电基板之间设置一个或多个导电接合连接。 电子基板的例子包括CMOS芯片，包括模拟电路，插入器和印刷电路板的集成电路。

公开(公告)号：EP3471897A1

公开(公告)日：2019-04-24

申请号：EP17815997.6

申请日：2017-06-19

Applicant: Butterfly Network, Inc.

Inventor： ROTHBERG, Jonathan M. ,  ALIE, Susan A. ,  ZAHORIAN, Jaime Scott ,  CRISTMAN, Paul Francis ,  FIFE, Keith G.

IPC: B06B1/02 ,  A61B8/12 ,  A61B8/14 ,  B06B1/06 ,  G01S15/89 ,  H01R4/02 ,  H01R12/51

公开(公告)号：EP3592474A1

公开(公告)日：2020-01-15

申请号：EP18763963.8

申请日：2018-03-07

Applicant: Butterfly Network, Inc.

Inventor： ROTHBERG, Jonathan M. ,  ALIE, Susan A. ,  FIFE, Keith G. ,  SANCHEZ, Nevada J. ,  RALSTON, Tyler S. ,  ZAHORIAN, Jaime Scott

IPC: B06B1/02 ,  B81B1/00 ,  B81C1/00 ,  B81C3/00 ,  H01L21/02 ,  G10K11/18 ,  G10K11/36

公开(公告)号：EP3586093A1

公开(公告)日：2020-01-01

申请号：EP18758144.2

申请日：2018-02-26

Applicant: Butterfly Network, Inc.

Inventor： ROTHBERG, Jonathan M. ,  FIFE, Keith G. ,  ALIE, Susan A. ,  LUTSKY, Joseph ,  GROSJEAN, David

IPC: G01H11/00 ,  B06B1/06 ,  H01L41/04 ,  H01L21/46

公开(公告)号：EP3383277A1

公开(公告)日：2018-10-10

申请号：EP16871467.3

申请日：2016-12-01

Applicant: Butterfly Network, Inc.

Inventor： ALIE, Susan A. ,  ZAHORIAN, Jaime Scott ,  CHEN, Kailiang

IPC: A61B8/00

CPC classification number: B06B1/02 ,  B06B1/0292

Abstract: Electrical biasing of ultrasonic transducers of an ultrasound device is described. The ultrasonic transducers may be capacitive micromachined ultrasonic transducers (CMUTs). The ultrasonic transducers may be grouped together, with the different groups receiving different bias voltages. The bias voltages for the various groups of ultrasonic transducers may be selected to account for differences between the groups.

公开(公告)号：EP3169450A1

公开(公告)日：2017-05-24

申请号：EP15744805.1

申请日：2015-07-14

Applicant: Butterfly Network Inc.

Inventor： ROTHBERG, Jonathan M. ,  ALIE, Susan A. ,  FIFE, Keith G. ,  SANCHEZ, Nevada J. ,  RALSTON, Tyler S.

IPC: B06B1/02

CPC classification number: G01N29/2406 ,  A61B8/4483 ,  B06B1/0292 ,  B81B7/007 ,  B81B2201/0271 ,  B81C1/00238 ,  B81C1/00301 ,  B81C2201/019 ,  B81C2203/036 ,  B81C2203/0792 ,  H01L2224/4813 ,  H01L2924/0002 ,  H01L2924/146 ,  H01L2924/1461

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

Abstract translation: 描述了与互补金属氧化物半导体（CMOS）衬底集成的微机械超声换能器，以及制造这种器件的方法。 制造可能涉及两个独立的晶圆键合步骤。 晶片键合可用于在衬底中制造密封的空腔。 晶圆键合也可用于将衬底键合到另一衬底，例如CMOS晶圆。 至少第二晶片接合可以在低温下进行。