Abstract:
A multi-level conductive matrix structure for separating rows and columns of sub-pixels on the faceplate of a flat panel display device. In one embodiment, the present invention is formed partially of a first plurality of conductive ridges which are disposed on the faceplate between respective adjacent rows of sub-pixel regions. The present invention is further formed of a second plurality of conductive ridges which are orthogonally oriented with respect to and integral with the first plurality of conductive ridges such that a matrix structure is formed. In the conductive matrix of the present invention, the second plurality of conductive ridges have a height which is greater than the height of the first plurality of conductive ridges such that a multi-level conductive matrix is formed. However, the height of the second plurality of conductive ridges decreases to approximately the height of the first plurality of conductive ridges at respective intersections of the first and second plurality of conductive ridges. In so doing, the present invention provides a multi-level conductive matrix for separating rows and columns of sub-pixels on the faceplate of a flat panel display device.
Abstract:
A method for forming a conductively coated matrix structure for separating rows and columns of sub-pixels on the faceplate of a flat panel display device. In one embodiment, the present invention deposits a photoresistive material over the interior surface of a faceplate having a non-conductive matrix structure formed thereon. The photoresistive material is deposited into sub-pixel regions separated by the matrix structure. The photoresistive material is dried and exposed in the sub-pixel regions. After unexposed photoresistive material is removed, a layer of aluminum is evaporated over the interior surface of the faceplate such that the matrix structure and the exposed layer of photoresistive material in the sub-pixel regions is coated with a conductive layer of aluminum. Next, the present invention applies an etchant to the exposed photoresistive material disposed in the sub-pixel regions. The etchant removes the exposed photoresistive material and the overlying conductive layer of aluminum from the sub-pixel regions such that the conductive layer of aluminum remains only on the matrix structure, and does not cover the sub-pixel regions.
Abstract:
A method for forming a conductively coated matrix structure for separating rows and columns of sub-pixels (106) on the faceplate (104) of a flat panel display device. One embodiment deposits a photoresistive material (108) over the interior surface (102) of a faceplate having a non-conductive opaque matrix structure (100) formed thereon, and into sub-pixel regions separated by the matrix structure. The photoresistive material is dried and exposed to light (112) in the sub-pixel regions. After unexposed photoresistive material (110) is removed, a layer of aluminum is evaporated onto the interior surface of the faceplate such that the matrix structure and the exposed layer of photoresistive material in the sub-pixel regions is coated with conductive aluminum. Next, an etchant is applied to the exposed photoresistive material disposed in the sub-pixel regions, removing the exposed photoresistive material and the overlying Al layer from the sub-pixel regions, such that the conductive Al layer remains only on the matrix structure, and does not cover the sub-pixel regions.
Abstract:
A field emission display includes a substrate (100), field emitter structures (106) disposed within a dielectric layer (102), a gate electrode layer (104), an insulating material layer (110), and a conductive material layer (116) forming a conductive focusing waffle structure of the present invention.
Abstract:
On a flat panel display structure, having a raised black matrix (200) defining wells within the matrix, is deposited a non-conformal, planar layer of acrylic-containing aluminizing lacquer (208) over a layer of phosphors (206) residing within the wells of the black matrix. A planar layer of catalyst material (210) is deposited over the layer of lacquer (208). A planar aluminum layer (212) is subsequently deposited over the catalytic layer (210). Finally, a baking process is conducted at a temperature such that the lacquer layer (208) and the catalyst layer (210) are cleanly and completely evaporated. This temperature is relatively low so as not to adversely affect the reflectivity of the aluminum layer (212), damage the black matrix material (200), or induce oxidation of phosphors. A substantially planar and mirror-like aluminum surface is achieved.