USE OF SACRIFICIAL MASKING LAYER AND BACKSIDE EXPOSURE IN FORMING OPENINGS THAT TYPICALLY RECEIVE LIGHT-EMISSIVE MATERIAL, AND ASSOCIATED LIGHT-EMITTING STRUCTURE
    7.
    发明公开
    USE OF SACRIFICIAL MASKING LAYER AND BACKSIDE EXPOSURE IN FORMING OPENINGS THAT TYPICALLY RECEIVE LIGHT-EMISSIVE MATERIAL, AND ASSOCIATED LIGHT-EMITTING STRUCTURE 失效
    VERWENDUNG EINER OPFERMASKIERUNGSSCHICHT UNDRÜCKSEITIGERBELICHTUNG贝德埃尔斯通公司VONLÖCHERNZUR AUFNAHME VON LICHTEMITTIERENDEM材料,ZUGEHÖRIGELICHTEMITTIERENDE STRUKTUR

    公开(公告)号:EP0979525A4

    公开(公告)日:2000-09-27

    申请号:EP98918281

    申请日:1998-04-27

    CPC classification number: H01J29/085 H01J31/127

    Abstract: Openings are created in a structure by a process in which a plate is furnished with a sacrificial patterned masking layer divided into multiple laterally separated mask portions. A primary layer of actinic material is provided over the masking layer and in space between the mask portions. Material of the primary layer not shadowed by a mask formed with the mask portions is backside exposed to actinic radiation. Material of the primary layer not exposed to the radiation is removed. Segments of the masking layer not covered by exposed material of the primary layer are then removed. Consequently, openings extend through the primary layer where the segments of the masking layer have been removed. The process is typically employed in forming an optical device such as a flat-panel cathode-ray tube display in which the openings in the primary layer receive light-emissive material.

    Abstract translation: 通过其中板配备有被分成多个横向分离的掩模部分的牺牲图案化掩模层的工艺在结构中形成开口。 在掩模层上和掩模部分之间的空间中提供光化材料的主要层。 未被由掩模部分形成的掩模遮盖的主要层的材料背面暴露于光化辐射。 未暴露于辐射的主层材料被去除。 然后去除未被主层的暴露材料覆盖的掩蔽层的区段。 因此,开口延伸穿过掩模层的部分已被去除的主层。 该工艺通常用于形成诸如平板阴极射线管显示器的光学装置,其中主层中的开口接收发光材料。

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