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公开(公告)号:US20250169238A1
公开(公告)日:2025-05-22
申请号:US19031651
申请日:2025-01-18
Applicant: EPISTAR CORPORATION
Inventor: Jian-Zhi CHEN , Yen-Chun TSENG , Hui-Fang KAO , Yao-Ning CHAN , Yi-Tang LAI , Yun-Chung CHOU , Shih-Chang LEE , Chen OU
IPC: H10H20/83 , H01L25/075 , H10H20/819 , H10H20/824 , H10H20/825 , H10H20/831 , H10H20/841
Abstract: The present disclosure provides a semiconductor light-emitting device. The semiconductor light-emitting device includes a first semiconductor contact layer, a semiconductor light-emitting stack, a first-conductivity-type contact structure, a second semiconductor contact layer, a second-conductivity-type contact structure, a first electrode pad and a second electrode pad. The semiconductor light-emitting stack is located on the first semiconductor contact layer and comprising an active layer. The first-conductivity-type contact structure is located on the first semiconductor contact layer. The second semiconductor contact layer is located on the semiconductor light-emitting stack. The second-conductivity-type contact structure is located on the semiconductor light-emitting stack and electrically connected to the second semiconductor contact layer. The first electrode pad is located on the first-conductivity-type contact structure. The second electrode pad is located on the second-conductivity-type contact structure. The second-conductivity-type contact structure includes a bonding portion, an extension portion, and a connection portion.
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公开(公告)号:US20150028369A1
公开(公告)日:2015-01-29
申请号:US14513810
申请日:2014-10-14
Applicant: EPISTAR CORPORATION
Inventor: Jhih-Sian WANG , Chia-Liang HSU , Yi-Ming CHEN , Yi-Tang LAI
IPC: H01L27/15 , H01L25/075 , H01L33/62
CPC classification number: H01L25/0753 , F21K9/00 , F21Y2105/10 , F21Y2105/12 , F21Y2115/10 , H01L27/156 , H01L33/38 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2924/00
Abstract: A light-emitting diode device having two electrode pads for connecting to an external power comprises a substrate; a plurality of light-emitting diode units on the substrate; and a plurality of conductive connecting structures electrically connecting the plurality of light-emitting diode units; wherein the two electrode pads are encircled by the plurality of light-emitting diode units.
Abstract translation: 具有用于连接到外部电力的两个电极焊盘的发光二极管器件包括衬底; 在所述基板上的多个发光二极管单元; 以及电连接多个发光二极管单元的多个导电连接结构; 其中两个电极焊盘被多个发光二极管单元包围。
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公开(公告)号:US20200152831A1
公开(公告)日:2020-05-14
申请号:US16680207
申请日:2019-11-11
Applicant: EPISTAR CORPORATION
Inventor: Yung-Fu CHANG , Hui-Fang KAO , Yi-Tang LAI , Shih-Chang LEE , Wen-Luh LIAO , Mei Chun LIU , Yao-Ru CHANG , Yi HISAO
IPC: H01L33/14 , H01L25/075 , H01L33/40
Abstract: A semiconductor device includes a conductive layer, a semiconductor stack, a first contact structure, an intermediate structure, a second contact structure, a first electrode and a second electrode. The semiconductor stack is disposed on the conductive layer. The first contact structure is disposed on the semiconductor stack. The intermediate structure encloses the first contact structure. The second contact structure is between the conductive layer and the semiconductor stack. The first electrode is on the conductive layer and separated from the semiconductor stack. The second electrode is on the intermediate structure.
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公开(公告)号:US20150262980A1
公开(公告)日:2015-09-17
申请号:US14727230
申请日:2015-06-01
Applicant: Epistar Corporation
Inventor: Jhih-Sian WANG , Chia-Liang HSU , Yi-Ming CHEN , Yi-Tang LAI
IPC: H01L25/075 , H01L33/62 , H01L27/15
CPC classification number: H01L25/0753 , F21K9/00 , F21Y2105/10 , F21Y2105/12 , F21Y2115/10 , H01L27/156 , H01L33/38 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2924/00
Abstract: A light-emitting diode device includes a transparent substrate having an edge side, a peripheral region and a central region surrounded by the peripheral region; and a plurality of light-emitting diode units disposed along the peripheral region and having a first light-emitting diode unit with an edge parallel to the edge side. The central region is devoid of any light-emitting diode unit.
Abstract translation: 发光二极管装置包括具有边缘侧,周边区域和由周边区域包围的中央区域的透明基板; 以及沿着周边区域设置的多个发光二极管单元,并且具有边缘平行于边缘侧的第一发光二极管单元。 中央区域没有任何发光二极管单元。
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公开(公告)号:US20210305456A1
公开(公告)日:2021-09-30
申请号:US17211331
申请日:2021-03-24
Applicant: EPISTAR CORPORATION
Inventor: Jian-Zhi CHEN , Yen-Chun TSENG , Hui-Fang KAO , Yao-Ning CHAN , Yi-Tang LAI , Yun-Chung CHOU , Shih-Chang LEE , Chen OU
IPC: H01L33/36 , H01L33/20 , H01L33/38 , H01L25/075
Abstract: The present disclosure provides a semiconductor light-emitting device and a semiconductor light-emitting component. The semiconductor light-emitting device includes a substrate, a first semiconductor contact layer, a semiconductor light-emitting stack including an active layer, a first-conductivity-type contact structure, a second semiconductor contact layer, a second-conductivity-type contact structure and a first electrode pad. The first-conductivity-type contact structure is electrically connected to the first semiconductor contact layer. The second-conductivity-type contact structure is electrically connected to the second semiconductor contact layer. The first-conductivity-type contact structure has a first bottom surface and a first top surface, and the active layer has a second bottom surface and a second top surface. The first bottom surface is lower than the second bottom surface, and the first top surface is higher than the second top surface in a cross-sectional view of the semiconductor light-emitting device.
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公开(公告)号:US20140225138A1
公开(公告)日:2014-08-14
申请号:US14174036
申请日:2014-02-06
Applicant: Epistar Corporation
Inventor: Tsung-Hsien YANG , Tzu-Chieh HSU , Yi-Ming CHEN , Yi-Tang LAI , Jhih-Jheng YANG , Chih-Wei WEI , Ching-Sheng CHEN , Shih-I CHEN , Chia-Liang HSU , Ye-Ming HSU
IPC: H01L33/22
CPC classification number: H01L33/02 , H01L33/0079
Abstract: A light-emitting device is disclosed and comprises: a transparent substrate; a semiconductor light-emitting stack on the transparent substrate, wherein the semiconductor light-emitting stack comprises a first semiconductor layer close to the transparent substrate, a second semiconductor layer away from the transparent substrate, and a light-emitting layer capable of emitting a light disposed between the first semiconductor layer and the second semiconductor layer; and a bonding layer between the transparent substrate and the semiconductor light-emitting stack, wherein the bonding layer has a gradually changed refractive index, and each of critical angles at the bonding layer and the transparent substrate for the light emitted from the light-emitting layer towards the transparent substrate is larger than 35 degrees.
Abstract translation: 公开了一种发光器件,包括:透明衬底; 在所述透明基板上的半导体发光层,其中,所述半导体发光层包括靠近所述透明基板的第一半导体层,远离所述透明基板的第二半导体层,以及能够发光的发光层 设置在第一半导体层和第二半导体层之间; 以及在所述透明基板和所述半导体发光叠层之间的接合层,其中所述接合层具有逐渐变化的折射率,并且所述接合层处的临界角和从所述发光层发射的光的所述透明基板 朝向透明基板大于35度。
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