公开(公告)号：CA2061120A1

公开(公告)日：1992-10-30

申请号：CA2061120

申请日：1992-02-12

Applicant: IBM

Inventor： BEILSTEIN KENNETH E JR ,  BERTIN CLAUDE L ,  WHITE FRANCIS R

IPC: C23C16/06 ,  H01L21/311 ,  H01L21/312 ,  H01L21/3213 ,  H01L21/336 ,  H01L21/47 ,  H01L21/8242 ,  H01L27/10 ,  H01L27/108 ,  H01L29/78 ,  H01L21/027

Abstract: BU9-89-027 A method is described for selectively masking sidewall regions of a concave surface formed in a semiconductor body, the method comprising the steps of: forming a conformal layer of masking material on a sidewall of the concave structure; emplacing in the concave structure, a selectively removable material that partially fills the concave structure, an upper surface of the material determining the edge of a region of the concave structure to be masked; removing a portion of the conformal layer above the upper surface of the selectively removable material; and removing the selectively removable material to leave a region of remaining conformal material as a mask.

公开(公告)号：FR2384389A1

公开(公告)日：1978-10-13

申请号：FR7804183

申请日：1978-02-08

Applicant: IBM

Inventor： BEILSTEIN KENNETH E JR ,  KOTECHA HARISH N

IPC: H01L21/822 ,  H01L21/761 ,  H01L21/8236 ,  H01L27/04 ,  H01L27/088 ,  H03K17/687 ,  H03K19/094 ,  H03K19/0944 ,  H03K19/40 ,  H03K19/08